Method and apparatus for wafer-level burn-in and testing of integrated circuits

• US 6,806,494 B2
• Filed: 05/27/2003
• Issued: 10/19/2004
• Est. Priority Date: 04/25/2000
• Status: Expired due to Fees

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Thompson, David L., Fenner, Andreas A.
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): TRAN, MAI HUONG C
• Application Number:
  US10/445,547
• Publication Number:
  US 20030205737A1
• Time in Patent Office: 511 Days
• Field of Search: 437/8, 437/190, 437/226, 438/15, 438/118, 438/613
• US Class Current: 257/48
• CPC Class Codes: G01R 31/2831 Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates G01R31/318511 takes precedence; testing during manufacture H01L22/00
• CPC Class Codes: G01R 31/316 Testing of analog circuits G01R31/2851 takes precedence

Abstract

In one embodiment, a testing regimen is implemented to reduce test time. Specifically, a structure and method to power up and stabilize all die on the wafer prior to testing each die is implemented. More specifically, parallel powering schemes including die stabilization procedures are used to ready the wafer for testing. A wafer probe tester is indexed from one die to the next for an uninterrupted testing of all die in the wafer subsequent to all die power up and stabilization.

Claims

1. A method of inspecting a burn-in testing result of a plurality of dies, comprising:

coupling an external power supply to at least one conductive pad disposed in an inactive region of a semiconductor wafer; and

inspecting each of a plurality of burn-in indicating apparatuses, wherein each of said plurality of burn-in indicating apparatuses is coupled to a corresponding one die of a plurality of dies and is disposed on an active region of said semiconductor wafer, to determine whether a burn-in parameter has been satisfied.

2. A method according to claim 1, further comprising:

discarding each single die of the plurality of dies in the event that the burn-in parameter has not been satisfied.

3. A method according to claim 1, further comprising:

marking each single die of the plurality of dies with a visually perceptible indicia in the event that the burn-in parameter has not been satisfied.

4. A method according to claim 1, further comprising:

retaining each single die of the plurality of dies with a visually perceptible indicia in the event that the burn-in parameter has been satisfied.

5. A method according to claim 1, further comprising:

continuing with further testing or manufacturing operations for each single die of the plurality of dies that has satisfied the burn-in parameter.

6. A method according to claim 1, further comprising, in the event that less than half of the plurality of dies has satisfied the burn-in parameter;

discarding said plurality of dies.

7. A method according to claim 1, wherein burn-in parameter comprises either:

a die power-on timer for the period that the external power supply is coupled to each of the plurality of dies;

or

a period of time a circuit disposed on a one of the plurality of dies is operating.

8. A method according to claim 1, wherein the burn-in indicating apparatus comprises either;

a one-bit counter adapted to switch when a pre-determined period of burn-in time has elapsed or a memory device adapted to record an aspect of the burn-in parameter.

9. A method according to claim 1, wherein said memory device comprises at least one fuse or a programmable memory device.