Semiconductor device having leads provided with interrupter for molten resin

• US 6,806,506 B2
• Filed: 07/16/2002
• Issued: 10/19/2004
• Est. Priority Date: 07/17/2001
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Tsuji, Kazuyoshi
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US10/196,908
• Publication Number:
  US 20030027372A1
• Time in Patent Office: 826 Days
• Field of Search: 257/88, 257/89, 257/91, 257/92, 257/93, 257/99, 257/100
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A semiconductor device includes semiconductor elements, a housing for accommodating the semiconductor elements, a resin material arranged in the housing for enclosing the semiconductor elements, and leads connected to the semiconductor elements. Each lead is divided into two portions, that is, an inner portion embedded in the resin material and an outer portion protruding from the resin material. The outer portion of the lead is provided with an enlarged part having a barrier surface directed toward the resin material.

Claims

1. A semiconductor device comprising:

a semiconductor element;

a housing that accommodates the semiconductor element, the housing having a hollow inner space and a bottom mounting surface;

a resin material filled within the hollow inner space of the housing short of the bottom mounting surface for enclosing the semiconductor element; and

a lead that is connected to the semiconductor element and includes an inner portion embedded in the filled resin material and an outer portion protruding from the filled resin material;

wherein said outer portion is provided with an enlarged part positioned outside the filled resin material and including a barrier surface directed toward the filled resin material, the enlarged part being located between the bottom mounting surface of the housing and the filled resin material.

2. The device according to claim 1, wherein said outer portion includes a connection terminal that is farther from the resin material than the barrier surface is.

3. The device according to claim 2, wherein the connection terminal is smaller in width than the enlarged part.

4. The device according to claim 1, wherein the semiconductor element emits light, the housing being formed with an opening that allows passage of the emitted light.