Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum

• US 6,806,557 B2
• Filed: 09/30/2002
• Issued: 10/19/2004
• Est. Priority Date: 09/30/2002
• Status: Expired due to Fees

• Current Assignee: Temic Automotive of North America, Incorporated (Continental AG)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Ding, Xiaoyi
• Primary Examiner(s): Nguyen, Cuong
• Application Number:
  US10/260,675
• Publication Number:
  US 20040061207A1
• Time in Patent Office: 750 Days
• Field of Search: 257/659-660, 257/704, 438/108-113, 438/125
• US Class Current: 257/659
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]

Abstract

A microdevice that comprises a device microstructure (22), a substrate (24), and a silicon cap (30, 130). The device microstructure (22) is attached to the substrate (24). The silicon cap (30, 130) has a base portion (32, 132) and a sidewall (34, 134) that defines a recess (36, 136) in the cap (30, 130). The silicon cap (30, 130) is attached to the substrate (24) such that the recess (36, 136) in the cap (30, 130) houses the device microstructure (22) and forms a hermetically sealed cavity (38) adjacent the device microstructure (22). The silicon cap (30, 130) further has a single crystalline silicon getter layer (40, 140) embedded along its recess (36, 136) for maintaining a vacuum within the cavity (38). There are also methods of making a microdevice containing a single crystalline silicon getter layer (40, 140).

Claims

1. A hermetically sealed microdevice comprising:

a substrate;

a device microstructure attached to the substrate;

a silicon cap having a base portion and a sidewall that defines a recess in the cap, the cap attached to the substrate such that the recess in the cap houses the device microstructure and forms a hermetically scaled cavity adjacent the device microstructure; and

at least one via and a cover, be via extending through the substrate and terminating at a via contact point on an inner surface of the substrate, the via cover attached to the inner surface of the substrate in a region around the via contact point on the substrate to hermetically seal the via;

wherein the silicon cap has a single crystalline silicon getter layer embedded along its recess for maintaining a vacuum within the cavity.

2. The microdevice of claim 1 wherein the substrate is made of glass.

3. The microdevice of claim 1 wherein the embedded single crystalline silicon getter layer is in a spaced apart relationship from the device microstructure.

4. The microdevice of claim 3 wherein the embedded single crystalline silicon getter layer is corrugated along at least a bottom surface of the recess of the cap.

5. The microdevice of claim 3 wherein the embedded single crystalline silicon getter layer is activated to adsorb vapor and gas species generated during the sealing process and outgassed from at least the substrate.

6. The microdevice of claim 1 wherein the microdevice is a gyroscope-sensing element.

7. The microdevice of claim 1 wherein the embedded single crystalline silicon getter layer is formed in the silicon cap through an electrochemical etch technique.

8. The microdevice of claim 1 wherein the embedded single crystalline silicon getter layer further includes at least one metallic material that is selectively deposited along at least a bottom surface of the recess of the cap.

9. A microdevice assembly comprising:

a hermetically sealed housing having an internal cavity;

a microdevice die having a substrate and a microstructure formed thereon, the microdevice die mounted within the internal cavity of the hermetically sealed housing;

at least one and a cover, the via extending though the housing and terminating at a via contact point on an inner surface of the housing, the via cover attached to the inner surface of the housing in a region around the via contact point to hermetically seal the via; and

at least one porous single crystalline silicon getter die mounted within the internal cavity for maintaining a vacuum within the internal cavity surrounding the microdevice die.

10. The microdevice assembly of claim 9 wherein the porous single crystalline silicon getter die is mounted in a apart relationship to the microdevice die.

11. The microdevice assembly of claim 9 wherein the microdevice assembly further includes a plurality of porous single crystalline silicon getter dies mounted within the internal cavity for maintaining the vacuum within the internal cavity for the microdevice die.

12. The microdevice assembly of claim 9 wherein a first side of the porous single crystalline silicon getter die is mounted to the substrate and a second side of the porous single crystalline silicon getter die is mounted to an inner surface of the housing, at least a substantial portion of one of the first or second sides of the getter die accessible to vapor and gas adsorption within the sealed cavity.

13. The microdevice assembly of claim 9 wherein the porous single crystalline silicon getter die is formed from a silicon wafer through an electrochemical etching technique, the silicon wafer having no recesses.

14. The microdevice assembly of claim 9 wherein the porous single crystalline silicon getter die further includes at last one metallic material that is selectively deposited on a porous side of the getter die.

15. The microdevice assembly of claim 9 wherein the porous single crystalline silicon getter die is further corrugated along at least one side of the getter die.