Method and apparatus for processing an array of packaged semiconductor devices

• US 6,806,725 B2
• Filed: 02/25/2002
• Issued: 10/19/2004
• Est. Priority Date: 08/05/1992
• Status: Expired due to Term

• Current Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Original Assignee: ASM Assembly Automation Limited (ASMPT Ltd.)
• Inventors: Chow, Lap Kei Eric, Curito, M. Bilan Jr., Tsui, Ching Man Stanley
• Primary Examiner(s): Zarneke, David A.
• Assistant Examiner(s): PATEL, PARESH H
• Application Number:
  US10/083,177
• Publication Number:
  US 20020177875A1
• Time in Patent Office: 967 Days
• Field of Search: 324/754, 324/755, 324/760, 324/765, 324/158.1, 438/14-18, 438/460, 438/464
• US Class Current: 324/750.23
• CPC Class Codes: A61B 17/0218 for minimally invasive surgery A61B17/0281, A61B17/0469, A61B17/12013, A61B17/1285, A61B17/29, A61B17/320016 take precedence
• CPC Class Codes: A61B 17/29 Forceps for use in minimally invasive surgery
• CPC Class Codes: A61B 18/1445 at the distal end of a shaft, e.g. forceps or scissors at the end of a rigid rod
• CPC Class Codes: A61B 2017/2929 with a head rotatable about the longitudinal axis of the shaft
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67282 Marking devices
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.

Claims

1. A method of processing an unsingulated array of packaged semiconductor devices comprising the steps of:

mounting the singulated array of packaged semiconductor devices on a mounting device;

then singulating the packaged semiconductor devices to physically separate the packages; and

then

testing the singulated packaged semiconductor devices for defects while they are mounted on the mounting device and without removal therefrom.

2. A method according to claim 1, further comprising the step of applying markings to distinguish non-defective ones of the packaged semiconductor devices from defective ones after testing while they are still mounted on the mounting device.

3. A method according to claim 2, wherein the singulation, testing and marking steps are carried out at two or more stations.

4. A method according to claim 3, including the step of moving the packaged semiconductor devices at least between the testing and marking positions for testing and marking respectively.

5. A method according to claim 1, further including the step of detecting the alignments of the packaged semiconductor devices before testing, and orienting the array of packaged devices as desired before testing.

6. A method according to claim 2, wherein the markings are applied by directing a laser beam onto selected ones of the packages.

7. A method according to claim 6, wherein:

the mounting device comprises a film of laser transparent tape with an adhesive on one surface;

wherein the packaged semiconductor devices are mounted on the adhesive surface of the film of transparent tape; and

marking is effected by passing the laser beam through the film of laser transparent tape toward the adhesive surface thereof,

the surface of the packaged semiconductor device being marked being the one in contact with the adhesive surface of the tape.

8. A method according to claim 1, wherein the packaged semiconductor devices are maintained in a substantially coplanar relationship on the mounting device during testing.

9. A method according to claim 1, wherein the packaged semiconductor devices are tested in subsets selected such that adjacent devices are not tested simultaneously.

10. An apparatus for processing an unsingulated array of packaged semiconductor devices comprising:

a mounting device for mounting the unsingulated array of packaged semiconductor devices;

a singulating device for singulating the array of packaged semiconductor devices; and

a testing device operative to test each of the singulated packaged semiconductor devices for defects;

whereby singulation and testing of the singulated packaged semiconductor devices are conducted while they are mounted on the mounting device without removal therefrom.

11. An apparatus according to claim 10, including an inscribing device for applying markings to distinguish defective and non-defective tested packaged semiconductor devices while they are mounted on the mounting device.

12. An apparatus according to claim 11, wherein the singulation, testing and marking are carried out at two or more stations of the apparatus.

13. An apparatus according to claim 12, including a conveyor for moving the packaged semiconductor devices for processing at least between the testing and marking positions.

14. An apparatus according to claim 13, wherein the conveyor is adapted to move the packaged semiconductor devices relative to linear and rotary axes.

15. An apparatus according to claim 10, wherein the mounting means device comprises a film of material stretched on a support frame, and having an adhesive on one side for receiving the packaged semiconductor devices.

16. An apparatus according to claim 15, further including a vacuum chuck operative to maintain the position of the support frame and film during the singulation, testing and marking of the packaged semiconductor devices.

17. An apparatus according to claim 10, including an orienting device to adjust alignment of the packaged semiconductor devices and/or to locate the positions of defective ones of the packaged semiconductor devices.

18. An apparatus according to claim 17, wherein the orienting device is an image recognition vision system.

19. An apparatus according to claim 11, wherein the inscribing device is a laser device operative to mark a surface of the packaged semiconductor device by heating the surface.

20. An apparatus according to claim 19, wherein:

the mounting device comprises a film of transparent tape with an adhesive surface on which the packaged semiconductor devices are mountable; and

the laser device is operative to direct the laser beam generated thereby through the film toward the adhesive surface thereof to mark packaged semiconductor devices mounted on the adhesive surface.

21. An apparatus according to claim 20, including an inverting device to invert the transparent tape to expose the surface of each packaged semiconductor device mounted on said adhesive surface of the transparent tape to the laser device for marking.

22. An apparatus according to claim 14, wherein the conveyor is an XYZ-Theta table.

23. An apparatus according to claim 10, wherein the packaged semiconductor devices are maintained in a substantially coplanar relationship on the mounting device during testing.

24. An apparatus according to claim 10, wherein the packaged semiconductor devices are tested in subsets selected such that adjacent devices are not tested simultaneously.