MLC frequency selective circuit structures

• US 6,806,793 B2
• Filed: 12/13/2002
• Issued: 10/19/2004
• Est. Priority Date: 12/13/2002
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Pillai, Edward R., Long, David C., Hamel, Harvey C., Bhatia, Harsaran S., Tongue, Benjamin P., Setzer, Christopher D.
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): TAKAOKA, DEAN O
• Application Number:
  US10/318,933
• Publication Number:
  US 20040113721A1
• Time in Patent Office: 676 Days
• Field of Search: 333/172, 333/175, 333/184, 333/185, 336/200
• US Class Current: 333/175
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H03H 2210/012 Centre frequency; Cut-off frequency
• CPC Class Codes: H03H 7/0115 comprising only inductors and capacitors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence

Abstract

MLC (multilayer ceramic) frequency selective circuit structures are disclosed. The MLC frequency selective circuit structures have a solenoid and toroid coil geometry in a multilayer electronic package which functions as a frequency selective tuned circuit in which both the number of turns and the aspect ratio of the solenoid coil are selected to adjust the tuned frequency. In some embodiments, a plurality of such coils can be connected together to provide a selected bandwidth about a tuned center frequency.

Claims

1. A multilayer ceramic (MLC) frequency selective circuit that combines an inductive effect and a capacitive effect in an integrated structure which functions as a frequency dependent circuit, comprising:

a multilayer ceramic structure defining at least first and second spaced planes, the first and second spaced planes containing respectively a first and second plurality of metal shaped segments;

the metal shaped segments are rectangular in shape, and each metal shaped segment has a length of a few millimeters and a width of 50-500 microns, with the spacing between the metal shaped segments in the first and second planes being 15-100 microns, and the upper and lower metal shaped segments being separated by one or more layers of ceramic having holes formed therethrough for the vias;

a plurality of conductive vias connecting the first plurality of metal shaped segments in the first plane with the second plurality of metal shaped segments in the second spaced plane, thereby forming a conductive solenoid coil structure in a multilayer ceramic frequency selective circuit.

2. The MLC frequency selective circuit of claim 1, wherein the dimensions of the MLC circuit and of the metal shaped segments are selected to produce a particular center resonant frequency.

3. The MLC frequency selective circuit of claim 1, wherein the first plurality of rectangular shaped metal segments are positioned offset widthwise with respect to the second plurality of rectangular shaped metal segments.

4. The MLC frequency selective circuit of claim 3, wherein a via on a right side of a forward end of each of the first plurality of rectangular shaped metal segments extends downwardly to connect to a left side of a forward end of each of the second plurality of rectangular shaped metal segment, and a via on a left side of a rearward end of each of the first plurality of rectangular shaped metal segments extends downwardly to connect to a right side of a rearward end of each of the second plurality of rectangular shaped metal segments.

5. The MLC frequency selective circuit of claim 1, wherein a plurality of solenoid coils are connected together for inductive proximity coupling.

6. The MLC frequency selective circuit of claim 1, wherein the MLC frequency selective circuit is in a semiconductor chip.

7. The MLC frequency selective circuit of claim 1, wherein the MLC frequency selective circuit is in a multilayer ceramic package.

8. The MLC frequency selective circuit of claim 1, wherein the MLC frequency selective circuit is in a printed circuit board.

9. The MLC frequency selective circuit of claim 1, wherein the MLC circuit is embedded and potted in a high Q packaging material to provide a high Q energy storage capability in a multilayer integrated MLC package.

10. The MLC frequency selective circuit of claim 1, wherein each metal shaped segment is formed of a layer of metal patterned on a ceramic sheet.

11. The MLC frequency selective circuit of claim 1, wherein a plurality of the solenoid coils are connected together to provide a selected bandwidth about a center resonant frequency.

12. The MLC frequency selective circuit of claim 1, wherein a plurality of solenoid coils are connected together for capacitive coupling.

13. The MLC frequency selective circuit of claim 1, wherein a plurality of solenoid coils are connected together for inductive link coupling.

14. A multilayer ceramic (MLC) frequency selective circuit that combines an inductive effect and a capacitive effect in an integrated structure which functions as a frequency dependent circuit, comprising:

a multilayer ceramic structure defining at least first and second spaced planes, the first and second spaced planes containing respectively a first and second plurality of metal shaped segments;

substantially all of the metal shaped segments are triangular in shape, and form a toroidal shaped coil structure having a substantially round circumferential shape, wherein each triangular shaped segment has an inner radial triangular corner positioned adjacent to and pointing towards the middle of the toroidal shaped coil structure to form the toroidal shaped coil structure, and the inner radial triangular corners of the first plurality of triangular shaped segments overlap the inner radial triangular corners of the second plurality of triangular shaped segments, and the outer radial triangular sides of the first plurality of triangular shaped segments are circumferentially rotated and offset with respect to the outer radial triangular sides of the second plurality of triangular shaped segments;

a plurality of conductive vias connecting the first plurality of triangular shaped metal shaped segments in the first plane with the second plurality of triangular shaped metal shaped segments in the second spaced plane, wherein a via at a clockwise circumferential end of the outer radial triangular side of each of the first plurality of triangular segments connects to a counterclockwise circumferential end of the outer radial triangular side of each of the second plurality of triangular segments, and a via at the inner radial triangular corner of each of the first plurality of triangular segments connects to the overlapped inner radial triangular corner of each of the second plurality of triangular segments, thereby forming a conductive toroidal shaped coil structure in a multilayer ceramic frequency selective circuit.

15. The MLC frequency selective circuit of claim 14, wherein a plurality of solenoid coils are connected together for inductive proximity coupling.

16. The MLC frequency selective circuit of claim 14, wherein the MLC frequency selective circuit is in a semiconductor chip.

17. The MLC frequency selective circuit of claim 14, wherein the MLC frequency selective circuit is in a multilayer ceramic package.

18. The MLC frequency selective circuit of claim 14, wherein the MLC frequency selective circuit is in a printed circuit board.

19. The MLC frequency selective circuit of claim 18, wherein the dimensions of the MLC circuit and of the metal shaped segments are selected to produce a particular center resonant frequency.

20. The MLC frequency selective circuit of claim 18, wherein the first plurality of triangular shaped metal segments are positioned offset circumferentially with respect to the second plurality of triangular shaped metal segments.

21. The MLC frequency selective circuit of claim 14, wherein a plurality of solenoid coils are connected together for inductive link coupling.

22. The MLC frequency selective circuit of claim 14, wherein the MLC circuit is embedded and potted in a high Q packaging material to provide a high Q energy storage capability in a multilayer integrated MLC package.

23. The MLC frequency selective circuit of claim 14, wherein a plurality of the solenoid coils are connected together to provide a selected bandwidth about a center resonant frequency.

24. The MLC frequency selective circuit of claim 14, wherein a plurality of solenoid coils are connected together for capacitive coupling.