Monitoring material buildup on system components by optical emission
First Claim
1. A method of monitoring material buildup on a system component in a plasma processing system, the method comprising:
- exposing a system component to a plasma, the system component containing an emitter capable of fluorescent light emission when exposed to the plasma; and
monitoring the fluorescent light emission from the plasma processing system during a process to determine buildup on the system component.
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Abstract
A method and system are provided for monitoring material buildup on system components in a plasma processing system. The system components contain emitters that are capable of producing characteristic fluorescent light emission when exposed to a plasma. The method utilizes optical emission to monitor fluorescent light emission from the emitters for determining system component status. The method can evaluate material buildup on system components in a plasma, by monitoring fluorescent light emission from the emitters. Consumable system components that can be monitored using the method include rings, shields, electrodes, baffles, and liners.
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Citations
47 Claims
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1. A method of monitoring material buildup on a system component in a plasma processing system, the method comprising:
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exposing a system component to a plasma, the system component containing an emitter capable of fluorescent light emission when exposed to the plasma; and
monitoring the fluorescent light emission from the plasma processing system during a process to determine buildup on the system component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of monitoring material buildup on a system component in a plasma processing system, the method comprising:
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exposing a system component to a plasma, the system component containing an emitter capable of fluorescent light emission when exposed to the plasma; and
monitoring fluorescent light emission from the plasma processing system during a process, the monitoring including using an optical monitoring system to detect the wavelength and the intensity level of the fluorescent light emission, identifying the system component from the wavelength of the fluorescent light emission, and arriving at a determination of the status of material buildup on the system component.
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12. A plasma processing system, comprising:
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a plasma processing chamber;
a plasma source configured to create a plasma from a process gas;
a system component containing an emitter capable of fluorescent light emission when exposed to a plasma;
an optical monitoring system for monitoring light emission from the plasma processing chamber during processing to monitor status of material buildup on the system component; and
a controller configured to control the plasma processing system. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A plasma processing system, comprising:
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a plasma processing chamber;
a plasma source configured to create a plasma from a process gas;
a system component containing an emitter capable of fluorescent light emission when exposed to a plasma;
an optical monitoring system for monitoring light emission from the plasma processing chamber during processing to monitor status of material buildup on the system component;
wherein the optical monitoring system is further configured to identify the system component from the wavelength of the fluorescent light emission, to determine if the intensity level of the fluorescent emission exceeds a threshold value, to determine if the system component needs to be replaced, and based on the determination, either continue with the process or stop the process; and
a controller configured to control the plasma processing system.
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30. A monitorable consumable system component, comprising:
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an annular element; and
an emitter coupled to the annular element, the emitter being capable of fluorescent light emission during a plasma process, wherein the light emission is used to monitor status of material buildup on the system component. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
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Specification