Micro mirror unit including mirror substrate and wiring substrate spaced by conductive spacer

• US 6,806,992 B2
• Filed: 12/31/2002
• Issued: 10/19/2004
• Est. Priority Date: 05/24/2002
• Status: Active Grant

• Current Assignee: DRNC Holdings, Inc. (InterDigital, Inc.)
• Original Assignee: Fujitsu Limited, Fujitsu Media Devices Limited (Fujitsu Limited)
• Inventors: Tsuboi, Osamu, Mizuno, Yoshihiro, Soneda, Hiromitsu, Okuda, Hisao, Ueda, Satoshi, Sawaki, Ippei, Kouma, Norinao, Nakamura, Yoshitaka, Yamagishi, Fumio
• Primary Examiner(s): Schwartz, Jordan M.
• Assistant Examiner(s): STULTZ, JESSICA T
• Application Number:
  US10/331,500
• Publication Number:
  US 20030218793A1
• Time in Patent Office: 658 Days
• Field of Search: 359/223-226, 359/212, 359/214, 359/247, 359/254, 359/290-91, 359/296
• US Class Current: 359/291
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 6/3518 the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device MEMS devices in general B81B; manufacture of MEM devices in general B81C; micromechanical devices controlling the direction of light G02B26/0833
• CPC Class Codes: G02B 6/3556 NxM switch, i.e. regular arrays of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/357 Electrostatic force electrostatic forces controlling reflecting elements in general G02B26/0841
• CPC Class Codes: G02B 6/3584 constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: Y10S 359/904 Micromirror

Abstract

A micro mirror unit includes a micro mirror substrate, a wiring substrate and an electroconductive spacer disposed between these substrates. The micro mirror substrate includes a moving part, a frame and torsion bars connecting the moving part to the frame. The moving part is provided with a mirror-formed portion. The wiring substrate is formed with a wiring pattern. The electroconductive spacer electrically connects the frame to the wiring pattern, while also providing a space between the micro mirror substrate and the wiring substrate.

Claims

1. A micro mirror unit comprising:

a micro mirror substrate that includes a mirror-formed portion, a first frame surrounding the mirror-formed portion, first torsion bars connecting the mirror-formed portion to the first frame, second frame surrounding the first frame, and second torsion bars connecting the first frame to the second frame;

a wiring substrate formed with a wiring pattern; and

a plurality of electroconductive spacers for electrically connecting the micro mirror substrate to the wiring pattern and for spacing the micro mirror substrate and the wiring substrate apart from each other;

wherein the second frame includes a plurality of electroconductive islands electrically separated from each other, each of the electroconductive spacers being connected to a respective one of the electroconductive islands.

3. The micro mirror unit according to claim 1, wherein each of the electroconductive spacers comprises either one of a single bump and a plurality of bumps stacked one on another thicknesswise to the micro mirror substrate.

4. The micro mirror unit according to claim 1, wherein each of the electroconductive spacers is connected to at least one of the wiring pattern and said respective one of the electroconductive islands via an electrode pad.

5. The micro mirror unit according to claim 1, wherein each of the electroconductive spacers is connected to at least one of the wiring pattern and said respective one of the electroconductive islands via an electroconductive adhesive.

6. The micro mirror unit according to claim 4, wherein each of the electroconductive spacers and the electrode pad are fused to each other.

7. The micro mirror unit according to claim 4, wherein each of the electroconductive spacers and the electrode pad are press-contacted with each other.

8. The micro mirror unit according to claim 1, wherein the wiring substrate has a first surface facing the micro mirror substrate, the first surface being formed with a retreated portion for accommodation of each of the mirror-formed portions.

9. The micro mirror unit according to claim 8, wherein the wiring substrate has a second surface opposite to the first surface, the second surface being formed with part of the wiring pattern.

10. The micro mirror unit according to claim 9, wherein the wiring substrate includes an electrical conductor penetrating through the wiring substrate for electrical connection between the wiring pattern formed in the first surface and the wiring pattern formed in the second surface.

11. The micro mirror unit according to claim 1, further comprising an adhesive intervening between the micro mirror substrate and the wiring substrate.

12. The micro mirror unit according to claim 1, further comprising an additional spacer intervening between the second frame and the wiring substrate.

13. The micro mirror unit according to claim 12, wherein the additional spacer comprises a bump.

14. The micro mirror unit according to claim 1, wherein each of the mirror-formed portions is provided with a first comb-like electrode each of the first frames being provided with a second comb-like electrode for operation of the the mirror-formed portion by electrostatic force generated between the first and the second comb-like electrodes.

15. The micro mirror unit according to claim 1, wherein the second torsion bars extend perpendicularly to a direction in which the first torsion bars extend.

16. The micro mirror unit according to claim 14, wherein each of the first frames includes a third comb-like electrode, the second frame including, for each of the first frames, a fourth comb-like electrode for operation of the first frame by electrostatic force generated between the third and the fourth comb-like electrodes.

17. The micro mirror unit according to claim 1, wherein the micro mirror substrate includes a plurality of divisions insulated from each other by at least one of an insulating film and a gap.

2. A micro mirror unit comprising:

a micro mirror substrate including a plurality of mirror-formed portions, a plurality of frames each surrounding a respective one of the mirror-formed portions, first torsion bars connecting each of the mirror-formed portions to a respective one of the first frames, a second frame surrounding each of the first frames, and second torsion bars connecting each of the first frames to the second frame;

a wiring substrate formed with a wiring pattern; and

a plurality of electroconductive spacers for electrically connecting the micro mirror substrate to the wiring pattern and for spacing the micro mirror substrate and the wiring substrate apart from each other,

wherein the second frame includes, for each of the first frames, a plurality of electroconductive islands electrically separated from each other, each of the electroconductive spacers being connected to a respective one of the electroconductive islands.

18. A micro mirror unit comprising:

a micro mirror substrate mounted on a wiring substrate via a plurality of electrically separated electroconductive spacers, the micro mirror substrate including a mirror portion surrounded sequentially by first and second frames, the mirror portion and first and second frames being rotatably connected by first and second torsion bars, respectively,

wherein the second frame has a plurality of electroconductive islands each electrically connected to a respective one of the electroconductive spacers.