Heat sink and combinations

• US 6,807,058 B2
• Filed: 11/20/2002
• Issued: 10/19/2004
• Est. Priority Date: 11/20/2002
• Status: Active Grant

• Current Assignee: Lenovo International Limited (Lenovo Group Ltd.)
• Original Assignee: International Business Machines Corporation
• Inventors: Crippen, Martin Joseph, Matteson, Jason Aaron
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US10/300,058
• Publication Number:
  US 20040095726A1
• Time in Patent Office: 699 Days
• Field of Search: 361/700, 361/699, 361/702-704, 361/707, 361/709-711, 361/717-720, 257/706, 257/707, 257/713, 257/714, 257/715, 174/15.1, 174/15.2, 174/16.1, 174/16.3, 165/80.3, 165/88.4
• US Class Current: 361/700
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.

Claims

1. Apparatus for cooling an electronic device having a flat heat transfer surface comprising:

a rectilinear body of heat transferring material having opposing first and second planar surfaces;

a first body of fins affixed to said first planar surface and defining a first array of plurality of elongate tubular channels directing heat transfer fluid flow parallel to said planar surfaces; and

a second body of fins affixed to said second broad surface and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow parallel to said broad surfaces, said second body of fins extending over only a portion of said rectilinear body surface to thereby define a remaining portion exposed for heat transfer engagement with said heat transfer surface of said electronic device.

2. Apparatus according to claim 1 wherein said first body of fins extend over substantially the entire area of said first planar surface.

3. Apparatus according to claim 1 wherein said second body of fins extend over a rectangular area which is less than the entire area of said second planar surface and the remaining area includes an area for engaging said heat transfer surface and an area of separation from said second body of fins.

4. Apparatus according to claim 1 wherein said rectilinear body is a plate of a metal having high thermal conductivity.

5. Apparatus according to claim 1 wherein said rectilinear body is a heat pipe.

6. Apparatus according to claim 1 wherein said second broad surface comprises an area defining a heat receiving zone through which heat is transferred from a semiconductor device.

7. Apparatus according to claim 1 wherein said first and second arrays of tubular channels extend parallel one to the other.

8. Apparatus according to claim 1 wherein said first and second arrays of tubular channels define air flow passages.

9. Apparatus comprising:

a heat releasing semiconductor package; and

a heat sink engaging said semiconductor package to transfer heat therefrom, said heat sink having;

a rectilinear body of heat transferring material having opposing first and second planar surfaces;

a first body of fins affixed to said first planar surface and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow; and

a second body of fins affixed to said second planar surface and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow.

10. Apparatus according to claim 9 wherein said first body of fins extend over substantially the entire area of said first planar surface.

11. Apparatus according to claim 9 wherein said second body of fins extend over less than the entire area of said second planar surface and define an exposed residual rectangular area for engagement with said semiconductor package.

12. Apparatus according to claim 9 wherein said rectilinear body is a plate of a metal having high thermal conductivity.

13. Apparatus according to claim 9 wherein said rectilinear body is a heat pipe.

14. Apparatus according to claim 9 wherein said second planar surface comprises an area defining a heat receiving zone through which heat is transferred

from said semiconductor package.

15. Apparatus according to claim 9 wherein said first and second arrays of tubular channels extend parallel one to the other.

16. Apparatus according to claim 9 wherein said first and second arrays of tubular channels define air flow passages.

17. Apparatus comprising:

a printed circuit board;

a heat releasing semiconductor package mounted on said printed circuit board; and

a heat sink engaging said semiconductor package to transfer heat therefrom said heat sink having;

a rectilinear body of heat transferring material having opposing first and second planar surfaces, said planar surfaces extending parallel to said printed circuit board;

a first body of fins affixed to said first planar surface so as to extend away from said printed circuit board and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow; and

a second body of fins affixed to said second planar surface so as to extend toward said printed circuit board and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow.

18. Apparatus according to claim 17 wherein said first body of fins extend over substantially the entire area of said first planar surface.

19. Apparatus according to claim 17 wherein said second body of fins extend over less than the entire area of said second planar surface to define an exposed rectangular area of said second planar surface for heat exchanging engagement.

20. Apparatus according to claim 17 wherein said rectilinear body is a plate of a metal having high thermal conductivity.

21. Apparatus according to claim 17 wherein said rectilinear body is a heat pipe.

22. Apparatus according to claim 17 wherein said second planar surface comprises an area defining a heat receiving zone through which heat is transferred from said semiconductor package.

23. Apparatus according to claim 17 wherein said first and second arrays of tubular channels extend parallel one to the other.

24. Apparatus according to claim 17 wherein said first and second arrays of tubular channels define air flow passages.

25. Apparatus comprising:

a heat releasing semiconductor package mounted on a circuit board and having a heat-transfer surface parallel to the circuit board; and

a heat sink engaging said semiconductor package, at said heat transfer surface, to transfer heat therefrom, said heat sink having;

a plate of heat transferring material having opposing first and second planar surfaces;

a first body of fins affixed to said first planar surface and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow parallel to said circuit board; and

a second body of fins affixed to said second planar surface and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow to said circuit board, said second body of fins extending over a only portion of said second planar surface to define a residual area which engages said heat-transfer surface of said semiconductor package for heat transfer.

26. Apparatus comprising:

a printed circuit board;

a heat releasing semiconductor package mounted on said printed circuit board and having a heat exchange surface extending parallel to said printed circuit board; and

a heat sink engaging said heat exchange surface of the semiconductor package to transfer heat therefrom said heat sink having;

a body of heat transferring material having opposing first and second planar surfaces, said planar surfaces extending parallel to said printed circuit board;

a first body of fins affixed to said first planar surface so as to extend away from said printed circuit board and defining a first array of a plurality of elongate tubular channels directing heat transfer fluid flow parallel to said circuit board; and

a second body of fins affixed to said second planar surface so as to extend toward said printed circuit board and defining a second array of a plurality of elongate tubular channels directing heat transfer fluid flow parallel to said circuit board, said second body of fins extending over only a portion of said second planar surface to leave a portion of said second planar surface exposed for contact with said semiconductor package for heat transfer.