Laser module and optical subassembly

• US 6,807,218 B1
• Filed: 05/13/2002
• Issued: 10/19/2004
• Est. Priority Date: 05/13/2002
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Yang, Jicheng, Greenwood, Jonathon, Darveaux, Robert
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): Rodriguez, Armando
• Application Number:
  US10/144,905
• Time in Patent Office: 890 Days
• Field of Search: 372/36, 372/50, 372/99, 372/107, 372/109, 372/34, 257/712, 257/717
• US Class Current: 372/107
• CPC Class Codes: G02B 6/262 Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/02255 using beam deflecting elements
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/02326 Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
• CPC Class Codes: H01S 5/02345 Wire-bonding
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/02415 by using a thermo-electric cooler [TEC], e.g. Peltier element
• CPC Class Codes: H01S 5/0683 by monitoring the optical output parameters

Abstract

A laser module includes an alignment plate having a template plate having a laser diode aperture and a photodiode aperture. A weld plate and a reflector are coupled to the template plate. The structure further includes a heat sink coupled to the alignment plate. A photodiode subassembly is mounted within the photodiode aperture and to the heat sink. Further, a laser diode subassembly is mounted within the laser diode aperture and to the heat sink. In the above manner, the photodiode subassembly, laser diode subassembly and reflected are precisely aligned.

Claims

1. A structure comprising:

an alignment plate comprising;

a template plate comprising a laser diode aperture and a photodiode aperture;

a weld plate coupled to said template plate; and

a reflector coupled to said template plate.

2. The structure of claim 1 further comprising a heat sink coupled to said alignment plate.

3. The structure of claim 2 further comprising a photodiode subassembly mounted within said photodiode aperture and to said heat sink.

4. The structure of claim 3 further comprising a laser diode subassembly mounted within said laser diode aperture and to said heat sink.

5. The structure of claim 4 wherein said alignment plate, said photodiode subassembly, and said laser diode subassembly are mounted to a first surface of said heat sink with a solder.

6. The structure of claim 1 further comprising an optical fiber coupled to said weld plate.

7. The structure of claim 1 wherein said reflector comprises a reflective surface.

8. A structure comprising:

a heat sink comprising;

a template plate; and

a weld plate coupled to said template plate,

a photodiode subassembly coupled to said template plate, said photodiode subassembly comprising a photodiode substrate comprising a pair of spaced apart parallel fingers defining a slot; and

a laser diode subassembly coupled to said template plate and located within said slot.

9. The structure of claim 8 wherein said photodiode subassembly further comprises a photodiode flip chip mounted to said photodiode substrate.

10. The structure of claim 9 further comprising a reflector coupled to said template plate and located within said slot directly below said photodiode.

11. A structure comprising:

a template plate coupled to a weld plate, said template plate comprising;

a main body;

a pair of spaced apart parallel fingers extending from said main body; and

a laser mounting surface contiguous with an inner side of said main body and inner sides of said pair of spaced apart parallel fingers, said inner side of said main body comprising a reflective surface.

12. The structure of claim 11 wherein said template plate further comprises stops located at tips of said pair of spaced apart parallel fingers.

13. The structure of claim 12 wherein said main body comprises an upper surface, said stops comprising:

raised surfaces; and

stops surfaces perpendicular to and extending between said upper surface of said main body and said raised surfaces of said stops.

14. The structure of claim 13 further comprising tabs projecting upwards from said upper surface of said main body.

15. The structure of claim 14 wherein said tabs in combination with said stops define a pocket.

16. The structure of claim 15 further comprising a photodiode subassembly coupled to said template plate within said pocket.

17. The structure of claim 16 wherein said photodiode subassembly comprises:

a photodiode substrate; and

a photodiode flip chip mounted to said photodiode substrate.

18. The structure of claim 17 wherein said photodiode substrate comprises a lower surface coupled to said upper surface of said main body.

19. The structure of claim 17 wherein said photodiode substrate comprises a photodiode aperture directly below and aligned with an active area of said photodiode.

20. The structure of claim 19 wherein said reflective surface is directly below and aligned with said photodiode aperture.

21. The structure of claim 11 wherein said inner side of said main body and said inner sides of said pair of spaced apart parallel fingers define a trench, said structure further comprising a laser diode subassembly coupled to said laser mounting surface and located within said trench.

22. A structure comprising:

a template plate coupled to a weld plate, said template plate comprising;

a main body;

a pair of spaced apart parallel fingers extending from said main body; and

a laser mounting surface contiguous with an inner side of said main body and inner sides of said pair of spaced apart parallel fingers;

a photodiode subassembly coupled to said template plate, said photodiode subassembly comprising;

a photodiode substrate; and

a photodiode flip chip mounted to said photodiode substrate, said photodiode substrate comprising a photodiode aperture directly below and aligned with an active area of said photodiode; and

a reflector coupled to said laser mounting surface, said reflector being located directly below and aligned with said photodiode aperture.

23. A structure comprising:

an alignment plate comprising;

a template plate comprising a laser diode aperture and a photodiode aperture;

a weld plate coupled to said template plate; and

a reflector coupled to said template plate;

a photodiode subassembly mounted within said photodiode aperture; and

a laser diode subassembly mounted within said laser diode aperture.

24. The structure of claim 23 further comprising a heat sink coupled to said alignment plate.

25. The structure of claim 24 wherein said photodiode subassembly is mounted to said heat sink.

26. The structure of claim 24 wherein said laser diode subassembly is mounted to said heat sink.

27. The structure of claim 24 wherein said alignment plate is mounted to a first surface of said heat sink with a solder.

28. The structure of claim 23 further comprising an optical fiber coupled to said weld plate.

29. A structure comprising:

a template plate comprising;

a main body;

a pair of spaced apart parallel fingers extending from said main body; and

a laser mounting surface contiguous with an inner side of said main body and inner sides of said pair of spaced apart parallel fingers;

a photodiode subassembly coupled to said template plate, said photodiode subassembly comprising a photodiode;

a reflector coupled to said laser mounting surface, said reflector being located directly below and aligned with said photodiode; and

a laser diode subassembly located within a slot defined by said inner side of said main body and said inner sides of said pair of spaced apart parallel fingers.