Adaptive off tester screening method based on intrinsic die parametric measurements

• US 6,807,655 B1
• Filed: 07/16/2002
• Issued: 10/19/2004
• Est. Priority Date: 05/17/2002
• Status: Expired due to Fees

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Abercrombie, David, Rehani, Manu, Madge, Robert, Cota, Kevin
• Primary Examiner(s): Siek, Vuthe
• Assistant Examiner(s): Dinh, Paul
• Application Number:
  US10/197,956
• Time in Patent Office: 826 Days
• Field of Search: 716/4-5, 438/14-18
• US Class Current: 716/136
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

A method for adaptively providing parametric limits to identify defective die quantizes the die into a plurality of groups according to statistical distributions, such as intrinsic speed in one embodiment. For each quantization level, an intrinsic distribution of the parameter is derived. Adaptive screening limits are then set as a function of the intrinsic distribution. Dies are then screened according to their parametric values with respect to the adaptive limits.

Claims

1. A method of determining the disposition of a semiconductor die and controlling the level of stringency used in determining the disposition, the method comprising:

measuring at least a first parameter for each of a plurality of dies, wherein the at least a first parameter includes at least one of the groups consisting of channel length, oxide thickness, current, and speed for the dies;

quantizing the plurality of dies into a plurality of groups according to the values of the first measured parameter, the groups based on an upper limit and a lower limit for the first measured parameter;

determining a statistical distribution for the dies in each of the plurality of groups;

determining an intrinsic distribution function for the plurality of dies from the statistical distribution;

setting an adaptive screening limit corresponding to the intrinsic distribution function; and

identifying whether the die falls outside the adaptive screening limit.

2. The method of determining the disposition of a semiconductor die as recited in claim 1, wherein a die that falls outside the adaptive screening limit is identified as a defective die.

3. The method of determining the disposition of a semiconductor die as recited in claim 1, wherein said method is using code running on a computing apparatus.

4. The method of determining the disposition of a semiconductor die as recited in claim 1, further comprising measuring a second parameter for each of the plurality of dies;

and wherein determining a statistical distribution for each of the plurality of groups comprises determining a statistical relationship for values of the second parameter for each of the plurality of groups.

5. The method of determining the disposition of a semiconductor die as recited in claim 4, wherein the first and second parameters are selected from the group consisting of measured parameters for the dies.

6. The method of determining the disposition of a semiconductor die as recited in claim 4, wherein the first and second parameters are selected from the group consisting of channel length, current, and speed for the dies.

7. The method of determining the disposition of a semiconductor die as recited in claim 4, wherein the first and second parameters are selected from the group consisting of static measurements and quiescent measurements for the dies.

8. The method of determining the disposition of a semiconductor die as recited in claim 4, wherein the first and second parameters are selected from the group consisting of oxide thickness, current, and speed for the dies.

9. The method of determining the disposition of a semiconductor die as recited in claim 4, wherein the setting an adaptive screening limit corresponding to the intrinsic distribution function comprises controlling the level of relaxation from the intrinsic distribution function.

10. The method of determining the disposition of a semiconductor die as recited in claim 9, wherein the level of relaxation is determined in accordance with the reliability expectations of the dies.

11. The method of determining the disposition of a semiconductor die as recited in claim 4, wherein the determining the intrinsic distribution function comprises deriving a statistical function to represent the intrinsic distribution of the first and second parameters.

12. The method of determining the disposition of a semiconductor die as recited in claim 1, wherein setting an adaptive screening limit comprises preemptively relaxing the screening limit in response to process changes which are expected to produce less defective dies over time.

13. The method of determining the disposition of a semiconductor die as recited in claim 12, wherein the process changes include changes in at least one of processing materials, gate lengths, processing chemicals, fabrication equipment, and processing techniques.

14. The method of determining the disposition of a semiconductor die as recited in claim 12, wherein preemptively relaxing the screening limit comprises relaxing the screening limit in at least two steps, the second step having a more relaxed screening limit than the first step.

15. The method of determining the disposition of a semiconductor die as recited in claim 1, wherein setting an adaptive screening limit comprises identifying a group of dies which are affected by a process fluctuation and adjusting the adaptive screening limit for the dies affected by the process fluctuation.

16. The method of determining the disposition of a semiconductor die as recited in claim 15, wherein the group of dies affected by the process fluctuation comprises a portion of a wafer.

17. The method of determining the disposition of a semiconductor die as recited in claim 1, wherein the plurality of dies comprises the dies on a particular wafer.

18. The method of determining the disposition of a semiconductor die as recited in claim 1, wherein the plurality of dies comprises the dies in a particular production lot.