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Method for producing multilayer substrate and electronic part, and multilayer electronic part

  • US 6,808,642 B2
  • Filed: 09/11/2002
  • Issued: 10/26/2004
  • Est. Priority Date: 12/28/2000
  • Status: Expired due to Fees
First Claim
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1. A method for producing a multi-layer substrate, comprising the steps of:

  • adhering a transfer film comprised of a resin film support layer having an adhesive layer comprised of a base polymer and a foaming agent thereon, the transfer film having an adhesive force ranging from 3.7 to 7.0 N/20 mm to an electrically conductive layer;

    patterning the conductor layer by etching to form a predetermined pattern;

    placing the transfer film overlaid with the patterned conductor layer on a prepreg such that the patterned conductor layer is in surface contact with a surface of the prepreg; and

    then compressing the combined layers and transfer film under a pressure of 4.9 to 39 Mpa while heating at 1300-1700 C; and

    peeling the transfer film from the conductor layer;

    thereby leaving the prepreg in contact with the conductor layer.

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