Heat conductive resin substrate and semiconductor package

• US 6,808,798 B2
• Filed: 04/18/2002
• Issued: 10/26/2004
• Est. Priority Date: 03/24/1999
• Status: Expired due to Fees

• Current Assignee: Polymatech Company Limited
• Original Assignee: Polymatech Company Limited
• Inventors: Tobita, Masayuki
• Primary Examiner(s): DIXON, MERRICK L
• Application Number:
  US10/125,734
• Publication Number:
  US 20030003287A1
• Time in Patent Office: 922 Days
• Field of Search: 428/298.1, 428/901, 428/359, 428/364, 428/374, 174/250, 174/102.SC, 257/613, 257/684, 361/704, 361/719
• US Class Current: 428/298.1
• CPC Class Codes: C08J 5/046 with synthetic macromolecular fibrous material
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/0278 Polymeric fibers
• CPC Class Codes: H05K 2201/0329 Intrinsically conductive polymer [ICP]; Semiconductive polymer
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/124 : Heterocyclic organic compounds, e.g. azole, furan
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 428/24994 : Fiber embedded in or on the surface of a polymeric matrix
• CPC Class Codes: Y10T 428/249942 : Fibers are aligned substantially parallel
• CPC Class Codes: Y10T 428/2904 : Staple length fiber
• CPC Class Codes: Y10T 428/2913 : Rod, strand, filament or fiber
• CPC Class Codes: Y10T 428/2931 : Fibers or filaments nonconcentric [e.g., side-by-side or eccentric, etc.]
• CPC Class Codes: Y10T 428/31623 : Next to polyamide or polyimide

Abstract

This invention relates to a heat conductive resin substrate which polybenzasol fibers are oriented in a thick direction and/or a direction of a surface of a resin substrate, further to the heat conductive resin substrate and a semiconductor package excellent in heat radiation ability which the semiconductor chips are mounted on the heat conductive resin substrate which the polybenzasol fibers are oriented in the thick direction (the Z direction) and/or the direction of the surface of the resin substrate, the heat conductive resin substance and the semiconductor package being provided with electrical insulation and high thermal conductivity, and being capable of controlling the thermal expansion coefficient.

Claims

1. A device comprising:

a substrate including a resin and polybenzasol fibers oriented in one of a thick direction and a surface direction of said substrate; and

a semiconductor chip mounted on said substrate.

2. A device in accordance with claim 1, wherein:

a concentration of said polybenzasol fibers are oriented in a concentration of approximately 2-80 in volume percentages.

3. A device according to claim 1, wherein:

said resin includes one of an epoxy resin, a polyimide resin, a bysmaleymide resin, a benzocyclobutene resin, a silicone resin, a fluoro resin, and a polyphenylene ether resin.

4. The device according to claim 1, wherein:

a thermal conductivity in one direction is 4 W/mK or more.

5. A device in accordance with claim 1, wherein:

a concentration of said polybenzasol fibers are oriented in a concentration of approximately 2-80 in volume percentages;

said resin includes one of an epoxy resin, a polyimide resin, a bysmaleymide resin, a benzocyclobutene resin, a silicone resin, a fluoro resin, and a polyphenylene ether resin;

a thermal conductivity in one direction is 4 W/mK or more.