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Thin micromachined structures

  • US 6,808,956 B2
  • Filed: 12/27/2000
  • Issued: 10/26/2004
  • Est. Priority Date: 12/27/2000
  • Status: Active Grant
First Claim
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1. A method for making a thin silicon structure comprising the steps of:

  • providing a glass wafer or substrate;

    providing a silicon wafer having a first substantially planar surface and a second substantially planar surface;

    forming a recess in said glass wafer or silicon wafer first surface;

    bonding said silicon wafer to said glass wafer such that at least part of said silicon wafer first surface bonds to said glass wafer and at least part of said silicon wafer first surface overhangs said recess;

    after said bonding step, selectively removing a portion of said silicon wafer from said silicon wafer second surface through to said silicon wafer first surface such that a silicon structure is formed overhanging said recess;

    providing a metal layer on the first substantially planar surface of the second wafer, such that the metal layer is patterned to approximately coincide with said recess;

    stopping the selective removal step at or near said metal layer to form the silicon structure; and

    removing said metal layer.

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