Integrated photosensor for CMOS imagers

• US 6,809,008 B1
• Filed: 08/28/2003
• Issued: 10/26/2004
• Est. Priority Date: 08/28/2003
• Status: Expired due to Fees

• Current Assignee: Motorola Solutions, Inc.
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Candelaria, Jon J., Holm, Paige M.
• Primary Examiner(s): TSAI, H JEY
• Application Number:
  US10/652,632
• Time in Patent Office: 425 Days
• Field of Search: 438/455-459
• US Class Current: 438/455
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An exemplary system and method for providing an integrated photosensing element suitably adapted for use in CMOS imaging applications is disclosed as comprising inter alia: a processed CMOS host wafer (460) bonded with a monocrystalline, optically active donor wafer (300); a photosensing element (390) integrated in said optically active donor wafer (300) having an interconnect via (505, 495, 485) substantially decoupled from the photosensing element (390), wherein the host (460) and donor (300) wafers are bonded through the optically active material in a region disposed near a metalization surface (450, 455, 445) of the CMOS layer (460) in order to allow fabrication of the interconnect (505, 495, 485). Disclosed features and specifications may be variously controlled, configured, adapted or otherwise optionally modified to further improve or otherwise optimize photosensing performance or other material characteristics. Exemplary embodiments of the present invention representatively provide for integrated photosensing components that may be readily incorporated with existing technologies for the improvement of CMOS imaging, device package form factors, weights and/or other manufacturing, device or material performance metrics.

Claims

1. A method for making an integrated CMOS-based imaging component, said method comprising the steps of:

providing at least one of a donor SOI wafer and a donor p-type wafer;

providing a host CMOS wafer;

optionally at least one of growing and at least partially converting said SOI wafer to p-type;

growing at least one of an intrinsic or p-epitaxial layer on said donor wafer;

growing a thermal oxide layer over said at least one of an intrinsic or p-epitaxial layer of said donor wafer;

optionally forming alignment keys in a Si layer of said donor wafer;

said alignment keys corresponding to base keys on said host wafer;

defining an optically active, monocrystalline photosensor region in said donor wafer;

fabricating at least one photodiode in said donor wafer using a plurality of ion implant steps;

optionally forming an optically reflective structure over the top surface of said donor wafer;

at least one of planarizing and preparing said donor wafer for bonding;

at least one of planarizing and preparing said host wafer for bonding;

aligning said host wafer with said donor wafer;

bonding said host wafer with said donor wafer through an interface substantially proximate to metal interconnects of said host CMOS wafer;

removing substrate material from said donor surface of the resulting donor/host composite structure;

etching at least one via within at least one region of the donor/host composite structure'"'"'s top surface down to landing pads of said CMOS wafer;

at least one of clearing, metallizing and plugging said vias with a metal;

optionally re-planarizing the top surface of said donor/host composite structure;

optionally forming at least one of a top side anti-reflective coating and a top side passivation layer; and

opening access vias to I/O pads embedded in said CMOS wafer.

2. The method of claim 1, wherein said optically active photosensor region comprises at least one of Si, GaAs, InP, GaN, HgCdTe, a-Si, p-Si, x-Si, Ge, SiGe, SiC, a monocrystalline material, a polycrystalline material and an amorphous material.

3. The method of claim 1, wherein said host CMOS layer is substantially fully pre-processed.

4. The method of claim 1, wherein said bonding of said host wafer with said donor wafer comprises at least one of wafer-to-wafer bonding and die-to-wafer bonding.