Method and apparatus for protecting wiring and integrated circuit device
First Claim
Patent Images
1. A micromachined device comprising:
- a substrate;
a conductor configured as part of said micromachined device;
a protective covering disposed over said conductor so that said conductor is disposed between said substrate and said protective covering; and
wherein said protective covering is configured so as to form a tunnel relative to said conductor.
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Accused Products
Abstract
A method and apparatus for protecting a conductor in an integrated circuit. A protective covering can be disposed over a conductor for a substantial length along the conductor while allowing a portion of the conductor to be exposed. The protective covering can be configured as a tunnel which runs for a substantial length along the conductor and can be operable to prevent the occurrence of electrical shorts during operation of the integrated circuit. According to one embodiment of the invention the integrated circuit can be configured as a micromachined device with active mechanical components exposed to the atmosphere.
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Citations
43 Claims
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1. A micromachined device comprising:
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a substrate;
a conductor configured as part of said micromachined device;
a protective covering disposed over said conductor so that said conductor is disposed between said substrate and said protective covering; and
wherein said protective covering is configured so as to form a tunnel relative to said conductor. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A micromachined apparatus comprising:
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a substrate;
a bonding pad;
a conductor disposed over said substrate, wherein said conductor is electrically coupled with said bonding pad;
an active mechanical component disposed over said substrate, wherein said active mechanical component is configured to move relative to said substrate;
a protective cover disposed over said conductor so that said conductor is disposed between said protective cover and said substrate;
wherein said protective layer of material is configured so as to form a tunnel relative to said conductor. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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16. A micromachined apparatus comprising:
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a bonding pad;
an active mechanical component configured to move during operation of said micromachined apparatus;
a conductor disposed between said active mechanical component and said bonding pad;
a covering configured so as to protect at least a portion of said conductor disposed between said bonding pad and said active mechanical component from electrical shorts;
wherein said covering is configured so as to form a tunnel relative to said conductor. - View Dependent Claims (17, 18, 19, 20, 21)
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22. An apparatus comprising:
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a substrate;
a conductor disposed over said substrate, said conductor operable for conducting electrical signals;
an equipotential barrier disposed at least partially around said conductor and operable for protecting said conductor from electrical shorts;
wherein said equipotential barrier comprises a conductive material configured as a tunnel over said conductor; and
wherein said conductive material is electrically coupled with said substrate. - View Dependent Claims (23, 24, 25)
wherein said polysilicon is electrically coupled with said substrate so as to form an equipotential ring.
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24. The apparatus as described in claim 23 wherein said equipotential ring is configured for coupling to a circuit ground during operation of said apparatus.
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25. The apparatus as described in claim 24 wherein said equipotential barrier is configured for coupling to a circuit ground during operation of said apparatus.
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26. A micromachined device comprising:
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a substrate;
a conductor configured as part of said micromachined device;
a protective covering disposed over said conductor so that said conductor is disposed between said substrate and said protective covering; and
wherein said protective covering is electrically coupled with said substrate so as to form a ground ring around said conductor. - View Dependent Claims (27, 28, 29, 30)
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31. A micromachined apparatus comprising:
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a substrate;
a bonding pad;
a conductor disposed over said substrate, wherein said conductor is electrically coupled with said bonding pad;
an active mechanical component disposed over said substrate, wherein said active mechanical component is configured to move relative to said substrate;
a protective cover disposed over said conductor so that said conductor is disposed between said protective cover and said substrate;
wherein said protective layer of material is configured so as to form a ground ring with said substrate around said conductor. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38)
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39. A micromachined apparatus comprising:
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a bonding pad;
an active mechanical component configured to move during operation of said micromachined apparatus;
a conductor disposed between said active mechanical component and said bonding pad;
a covering configured so as to protect at least a portion of said conductor disposed between said bonding pad and said active mechanical component from electrical shorts;
wherein said covering is configured so as to form at least part of a ground ring around said conductor. - View Dependent Claims (40, 41, 42, 43)
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Specification