Thin implantable RFID transponder suitable for use in an identification badge

• US 6,809,646 B1
• Filed: 11/18/2002
• Issued: 10/26/2004
• Est. Priority Date: 12/06/2001
• Status: Expired due to Fees

• Current Assignee: Applied Wireless Identifications Group Incorporated (AWID)
• Original Assignee: Applied Wireless Identifications Group Incorporated (AWID)
• Inventors: Lee, Donny V.
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US10/298,462
• Time in Patent Office: 708 Days
• Field of Search: 340/572.1, 340/572.7, 340/572.8, 340/5.8, 340/5.81, 235/382, 235/487, 298/25, 298/29, 257/679
• US Class Current: 340/572.1
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G07C 9/28 the pass enabling tracking or indicating presence

Abstract

There is provided an RFID transceiver, typically in the form of a prox-wafer. The transceiver is suitable for lamination or encapsulation into newly manufactured identification (ID) badges and similar articles. These ID badges are suitable for identifying and/or authenticating a person or object when used in conjunction with an RFID identification system. The proximity badges formed using the RFID transceivers are superior to conventional magnetic stripe, bar code, or “smart chip” badges because no direct contact with a badge reader is required and the element containing the identification code is not easily corrupted.

Claims

1. An RFID transponder for upgrading an existing identification badge, comprising:

a) a substrate having an upper surface and a lower surface;

b) an RF identification signal processing circuit disposed proximate said upper surface of said substrate;

c) an antenna electrically connected to said signal processing circuit and disposed proximate said upper surface of said substrate; and

d) adhesive means operatively connected to said lower side of said substrate for attaching said transponder to an existing identification badge.

2. The transponder in accordance with claim 1, wherein said substrate, said signal processing circuit, and said antenna define a prox-wafer.

3. The transponder in accordance with claim 2, wherein said prox-wafer is one of the shapes:

substantially circular, substantially rectangular, and polygonal.

4. The transponder in accordance with claim 3, wherein at least one edge or part of the edge of said prox-wafer is beveled.

5. The transponder in accordance with claim 3, further comprising epoxy bonding for sealing said signal processing circuit and said antenna and for forming a cap.

6. The transponder in accordance with claim 1, wherein said signal processing circuit comprises at least one of:

a half-duplex transponder circuit and a full-duplex transponder circuit.

7. The transponder in accordance with claim 1, wherein said signal processing circuit comprises at least one of the circuit types:

an active transponder circuit and a passive transponder circuit.

8. A badge for identifying an equipment operator, a service person or an employee, comprising:

a) a substantially planar, substantially rectangular, laminated card; and

b) a transponder adhesively attached to said laminated card, said transponder comprising;

i) a substrate having an upper surface and a lower surface;

ii) an RF identification signal processing circuit disposed proximate said upper surface of said substrate; and

iii) an antenna electrically connected to said signal processing circuit and disposed proximate said upper surface of said substrate.

9. The badge in accordance with claim 8, wherein said substrate, said signal processing circuit, and said antenna define a prox-wafer.

10. The badge in accordance with claim 9, wherein said prox-wafer is one of the shapes:

substantially circular, substantially rectangular, and polygonal.

11. The badge in accordance with claim 10, wherein at least one edge or part of the edge of said prox-wafer is beveled.

12. The badge in accordance with claim 9, further comprising epoxy bonding for sealing said signal processing circuit and said antenna and for forming a cap.

13. The badge in accordance with claim 8, wherein said signal processing circuit comprises at least one of the circuit types:

half-duplex transponder circuit, and full-duplex transponder circuit.

14. The badge in accordance with claim 11, wherein said signal processing circuit comprises at least one of the circuit types:

an active transponder circuit, and a passive transponder circuit.