Semiconductor dynamic sensor having circuit chip mounted on package case with adhesive film interposed

• US 6,810,736 B2
• Filed: 03/05/2003
• Issued: 11/02/2004
• Est. Priority Date: 03/20/2002
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Tanaka, Masaaki, Ikezawa, Toshiya, Saitou, Takashige
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US10/378,599
• Publication Number:
  US 20030177831A1
• Time in Patent Office: 608 Days
• Field of Search: 734/93, 734/88, 738/623.81, 735/143.2, 438/48, 438/50, 438/51, 438/52, 438/106, 438/107, 438/118, 438/125, 298/29, 298/31, 298/32, 156/60, 257/415
• US Class Current: 73/493
• CPC Class Codes: G01P 1/006 used for thermal compensation
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A semiconductor dynamic sensor such as an acceleration sensor is composed of a sensor chip for detecting a dynamic force applied thereto and a circuit chip for processing output signals from the sensor chip. The sensor chip is supported on the circuit chip, and both chips are mounted on a package case. To suppress thermal stress transfer from the package case to the sensor chip through the circuit chip, an adhesive film having an elasticity modulus lower than 10 MPa is interposed between the circuit chip and the package case. Characteristics of the sensor chip are kept stable by suppressing the thermal stress transfer from the package case.

Claims

1. A semiconductor dynamic sensor comprising:

a semiconductor sensor chip for detecting a dynamic force applied thereto;

a circuit chip for processing signals outputted from the semiconductor sensor chip, the semiconductor sensor chip being supported on the circuit chip; and

a package case for containing therein the semiconductor sensor chip and the circuit chip, the circuit chip being mounted on the package case with an adhesive film interposed therebetween, wherein the adhesive film has an elasticity modulus lower than 10 MPa.

2. The semiconductor dynamic sensor as in claim 1, wherein:

the adhesive film is a silicone-type adhesive film.

3. The semiconductor dynamic sensor as in claim 1 wherein:

the semiconductor sensor chip is supported on the circuit chip with another adhesive film interposed therebetween.