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Method and apparatus for forming deposition film, and method for treating substrate

  • US 6,811,816 B2
  • Filed: 07/16/2002
  • Issued: 11/02/2004
  • Est. Priority Date: 05/01/2000
  • Status: Expired due to Fees
First Claim
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1. A method for forming a deposition film on a substrate in a film deposition chamber, wherein a gas adsorptive member is placed in a space communicating with the film deposition chamber, the deposition film being deposited while continuously feeding a released gas component generated from the member into the space.

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