Computer enclosure and method for manufacture

• US 6,813,151 B1
• Filed: 08/15/2002
• Issued: 11/02/2004
• Est. Priority Date: 06/28/2002
• Status: Expired due to Term

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Silicon Graphics Incorporated (Graphics Properties Holdings, Inc.)
• Inventors: Vane, Cullen P.
• Primary Examiner(s): CHANG, YEAN HSI
• Application Number:
  US10/219,654
• Time in Patent Office: 810 Days
• Field of Search: 361/683-687, 361/724, 361/725
• US Class Current: 361/679.46
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613

Abstract

A computer enclosure and method for manufacture include a computer housing and an outer layer, the housing having an inner surface and an outer surface, the outer layer having a first surface and a second surface, wherein the first surface of the outer layer is coupled to the outer surface of the housing and covers a substantial portion of the outer surface, and the second surface of the outer layer has a graphic design applied thereto.

Claims

1. A computer enclosure, comprising:

a housing, the housing having an inner surface and an outer surface; and

an outer layer having a first surface and a second surface, the first surface coupled to the outer surface of the housing and covering a substantial portion of the outer surface, the second surface having a graphic design applied thereto;

a panel coupled to the housing, the panel covering an aperture of the housing, wherein couplers for the panel overlay part of the outer layer.

2. The enclosure of claim 1, wherein:

the outer layer comprises vinyl;

the first surface of the outer layer is adhered to the outer surface of the housing; and

the graphic design is applied to a substantial portion of the second surface of the outer layer.

3. The enclosure of claim 1, wherein:

the housing comprises a movable door to allow access to the inside of the housing; and

the outer layer is separated around the periphery of the movable door.

4. The enclosure of claim 1, wherein:

the housing contains at least one aperture to allow airflow between the inside and the outside of the housing; and

the outer layer contains at least one aperture to allow airflow between the inside and the outside of the housing.

5. The enclosure of claim 4, wherein the outer layer contains a plurality of apertures arranged in a grid to allow airflow between the inside and the outside of the housing.

6. The enclosure of claim 1, wherein a portion of the panel is hinged to allow access to the inside of the housing.

7. The enclosure of claim 1, wherein the outer layer covers at least forty percent of the outer surface of the housing.

8. A method for manufacturing a computer enclosure, comprising:

providing a housing having an inner surface and an outer surface; and

coupling the first surface of an outer layer having a first surface and a second surface to the outer surface of the housing, the first surface covering a substantial portion of the outer surface, the second surface having a graphic design applied thereto;

coupling a panel to the housing, the panel covering an aperture of the housing, wherein couplers for the panel overlay part of the outer layer.

9. The method of claim 8, wherein:

the outer layer comprises vinyl;

coupling the first surface to the outer surface comprises adhering the first surface to the outer surface; and

the graphic design is applied to a substantial portion of the second surface.

10. The method of claim 8, wherein the housing comprises a movable door to allow access to the inside of the housing.

11. The method of claim 10, further comprising separating the outer layer around the periphery of the movable door.

12. The method of claim 8, wherein:

the housing contains at least one aperture to allow airflow between the inside and the outside of the housing; and

the outer layer contains at least one aperture to allow airflow between the inside and the outside of the housing.

13. The method of claim 12, wherein the outer layer contains a plurality of apertures arranged in a grid to allow airflow between the inside and the outside of the housing.

14. The method of claim 8, wherein a portion of the panel is hinged to allow access to the inside of the housing.

15. The method of claim 10, wherein the outer layer covers at least forty percent of the outer surface of the housing.

16. A computer enclosure, comprising:

a computer housing, the housing having an inner surface and an outer surface, the housing comprising;

a movable panel to allow access to the inside of the housing,

a first aperture to allow airflow between the inside and the outside of the housing,

a second aperture to allow airflow between the inside and the outside of the housing, and

a third aperture to allow access to the inside of the housing;

an outer layer having a first surface and a second surface, the first surface adhered to the outer surface of the housing and covering at least seventy percent of the outer surface, the second surface having a graphic design applied thereto, the outer layer comprised of vinyl, separated around the periphery of the movable panel, and containing a plurality of apertures arranged in a grid to allow airflow between the inside and the outside of the housing, the apertures associated with the first aperture of the housing; and

a panel to cover the third aperture of the housing, the panel comprising a hinged portion to allow access to the inside of the housing, the panel coupled to the housing by couplers that overlay part of the outer layer.