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Method for improving airflow in subrack mechanics by using a hybrid serial/parallel fan configuration

  • US 6,813,152 B2
  • Filed: 01/16/2003
  • Issued: 11/02/2004
  • Est. Priority Date: 01/18/2002
  • Status: Expired due to Fees
First Claim
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1. A fan module for use in an electronic enclosure, the fan module comprising:

  • a housing;

    an air intake panel provided in a first side of the housing;

    an exhaust panel provided in a second side of the housing;

    a plurality of fans, the plurality of fans being successively spaced along a first Cartesian coordinate to allow a portion of the airflow from each fan to flow through each successive fan and a portion of the airflow from each fan to flow around each successive fan and staggered in at least one of a second and third Cartesian coordinate.

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