Lowly heat-expandable laminate

• US 6,815,053 B2
• Filed: 01/02/2003
• Issued: 11/09/2004
• Est. Priority Date: 03/27/2000
• Status: Expired due to Term

• Current Assignee: Japan Composite Co., Ltd., Panasonic Electric Works Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Japan Composite Co., Ltd., Asahi Matsushita Electric Works Ltd. (Panasonic Holdings Corporation)
• Inventors: Inoue, Tomoko, Okumura, Hiroya, Hirata, Isao, Okada, Shigehiro
• Primary Examiner(s): DIXON, MERRICK L
• Application Number:
  US10/221,373
• Publication Number:
  US 20040096680A1
• Time in Patent Office: 677 Days
• Field of Search: 428/220, 428/292.1, 428/297.4, 428/327, 428/323, 428/312.2, 428/328, 428/332, 428/359, 428/361, 428/372, 428/401, 428/403
• US Class Current: 428/323
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2262/101 Glass fibres
• CPC Class Codes: B32B 2264/02 Synthetic macromolecular particles
• CPC Class Codes: B32B 2305/72 Cured, e.g. vulcanised, cross-linked
• CPC Class Codes: B32B 2307/734 Dimensional stability
• CPC Class Codes: B32B 2398/20 Thermoplastics
• CPC Class Codes: B32B 2605/00 Vehicles
• CPC Class Codes: B32B 2605/12 Ships
• CPC Class Codes: B32B 27/04 as impregnant, bonding, or embedding substance not used
• CPC Class Codes: B32B 27/20 using fillers, pigments, thixotroping agents
• CPC Class Codes: B32B 5/022 Non-woven fabric
• CPC Class Codes: B32B 5/024 Woven fabric
• CPC Class Codes: B32B 5/26 another layer next to it also being fibrous or filamentary relative arrangement of fibres or filaments of different layers B32B5/12
• CPC Class Codes: C08F 283/01 on to unsaturated polyesters C08F283/004 takes precedence
• CPC Class Codes: C08F 290/064 Polymers containing more than one epoxy group per molecule
• CPC Class Codes: C08J 5/244 using glass fibres
• CPC Class Codes: C08J 5/249 characterised by the additives used in the prepolymer mixture
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0129 : Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0145 : Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
• CPC Class Codes: H05K 2201/0209 : Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0212 : Resin particles
• CPC Class Codes: H05K 2201/068 : wherein the coefficient of thermal expansion is important
• CPC Class Codes: Y10T 428/249924 : Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
• CPC Class Codes: Y10T 428/25 : Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/254 : Polymeric or resinous material
• CPC Class Codes: Y10T 428/26 : Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
• CPC Class Codes: Y10T 428/2904 : Staple length fiber
• CPC Class Codes: Y10T 428/2927 : including structurally defined particulate matter
• CPC Class Codes: Y10T 428/298 : Physical dimension
• CPC Class Codes: Y10T 428/2991 : Coated
• CPC Class Codes: Y10T 428/31786 : Of polyester [e.g., alkyd, etc.]

Abstract

A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150° C. is not higher than 20×10⁻⁶/° C. can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.

Claims

1. A low thermal expansion laminated plate obtained by curing a laminated material of fiber-reinforced layers impregnated with a thermosetting resin composition comprising a radically polymerizable resin (a), a thermoplastic resin (b), a radically polymerizable monomer (c) and an inorganic filler (d), wherein (a) is present in an amount of 10 to 75 parts by weight, (b) is present in an amount of 2 to 30 parts by weight, (c) is present in an amount of 20 to 60 parts by weight and (d) is present in an amount of 5 to 250 parts by weight, based on 100 parts by weight of the total weight of (a), (b) and (c).

2. A low thermal expansion laminated plate according to claim 1 wherein the average linear expansion coefficient of the laminate within the temperature ranging from 40°

C. to 150°

C. is not higher than 20×

10<sup>−

6</sup>/°

C.

3. A low thermal expansion laminated plate according to claim 1 wherein the glass transition point of the thermoplastic resin (b) is not higher than 60°

C.

4. A low thermal expansion laminated plate according to claim 1 wherein the thermoplastic resin (b) is a saturated polyester resin whose glass transition point is not higher than 60°

C.

5. A low thermal expansion laminated plate according to claim 1 wherein the thermoplastic resin (b) is a saturated polyester resin whose glass transition point is not higher than 60°

C. and whose number average molecular weight is 2,000 to 100,000.

6. A low thermal expansion laminated plate according to claim 1 further comprising a polymer fine particle (e) whose particle size is 0.1 to 5.0 μ

m.

7. A low thermal expansion laminated plate according to claim 1 wherein the laminated material of the fiber-reinforced layers is a composite laminated material comprising as a surface layer a glass fiber woven fabric impregnated with a thermosetting resin composition laminated with an inner lining layer which is a glass fiber non-woven fabric impregnated with a thermoplastic resin composition.

8. A low thermal expansion laminated plate according to claim 1 wherein the radically polymerizable resin (a) is a vinyl ester resin or unsaturated polyester resin.

9. A metal foil-covered laminated plate utilizing a low thermal expansion laminated plate according to claim 1.