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Electroless copper deposition apparatus

  • US 6,815,349 B1
  • Filed: 10/18/2002
  • Issued: 11/09/2004
  • Est. Priority Date: 10/19/2001
  • Status: Active Grant
First Claim
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1. An apparatus for engaging a work piece during plating, the apparatus comprising:

  • a cup having a circumferential side wall defining an interior region and a lip within the interior region arranged such that lip can support the work piece while the work piece remains within the interior region;

    a cone having a work piece contact surface that fits within the cup'"'"'s interior and can contact the work piece in a manner that holds the work piece in a fixed position against the cup'"'"'s lip;

    a circumferential cantilever member provided on the contact surface, which cantilever member elastically deflects holding the work piece in said fixed position.

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