×

Structure having flush circuitry features and method of making

  • US 6,815,709 B2
  • Filed: 05/23/2001
  • Issued: 11/09/2004
  • Est. Priority Date: 05/23/2001
  • Status: Expired due to Fees
First Claim
Patent Images

1. A structure having first and second major surfaces comprising:

  • a carrier foil forming a first said major surface;

    an electrically conductive layer on one of the major surfaces of the carrier foil;

    a dielectric layer located on the electrically conductive layer wherein the dielectric layer having circuitry features; and

    plated metal conductive circuitry located within the circuitry features wherein the metal conductive circuitry is substantially flush/coplanar with and surrounded by the dielectric layer, wherein said flush metal conductive circuitry forms interconnects from any via in the structure to any other via in the structure; and

    wherein said metal/dielectric co-plane forms said second major surface.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×