Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

• US 6,815,961 B2
• Filed: 03/08/2002
• Issued: 11/09/2004
• Est. Priority Date: 07/28/1999
• Status: Expired due to Fees

• Current Assignee: Advantest Corporation
• Original Assignee: NanoNexus, Inc.
• Inventors: Mok, Sammy, Chong, Fu Chiung
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): Nguyen, Trung Q.
• Application Number:
  US10/094,370
• Publication Number:
  US 20040022042A1
• Time in Patent Office: 977 Days
• Field of Search: 324/767, 324/437, 324/754, 324/757, 324/690, 324/724, 324/696, 324/158.1, 324/755, 430/320, 156/160, 156/163, 446/415, 446/14, 446/486, 273/145, 361/278, 361/298.2, 361/772
• US Class Current: 324/756.03
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 7/1061 co-operating by abutting

Abstract

Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Interleaved spring probe tip designs are defined which allow multiple probe contacts on very small integrated circuit pads. The shapes of probe tips are preferably defined to control the depth of probe tip penetration between a probe spring and a pad or trace on an integrated circuit device. Improved protective coating techniques for spring probes are also disclosed, offering increased reliability and extended useful service lives for probe card assemblies.

Claims

1. An apparatus extending from a substrate for connection to a device, comprising:

an electrically conductive compliant member comprising a plurality of layers having different inherent levels of stress formed on the substrate, comprising a fixed portion attached to the substrate and a free portion, the free portion extending from the fixed portion to an end defining a probe tip; and

a patterned electrically conductive coating formed on a coating region comprising at least a portion of the free portion extending from the probe tip, the electrically conductive coating comprising a material to minimize wear to the electrically conductive compliant member.

2. The apparatus of claim 1, wherein the material comprises a hard material.

3. The apparatus of claim 1, wherein the patterned electrically conductive coating is comprised of a wear resistant material.

4. The apparatus of claim 1, wherein the patterned electrically conductive coating is comprised of a relatively inert and noble material.

5. The apparatus of claim 1, wherein the patterned electrically conductive coating is comprised of a material that resists galling and oxidation.

6. The apparatus of claim 1, wherein the patterned electrically conductive coating is a protective coating.

7. The apparatus of claim 1, wherein the patterned electrically conductive coating is comprised of any of titanium nitride, rhodium, tungsten, and nickel.

8. The apparatus of claim 1, wherein the patterned electrically conductive coating covers at least a top surface and a side wall of the probe tip.

9. The apparatus of claim 1, wherein the electrically conductive coating is lithographically patterned.

10. The apparatus of claim 1, wherein the electrically conductive coating is patterned by coating the electrically conductive compliant member with the electrically conductive coating, applying a masking material to the coating region, etchably removing the electrically conductive coating from portions of the electrically conductive compliant member not covered by the masking material, and stripping the masking material to expose the electrically conductive coating on the coating region.