Please download the dossier by clicking on the dossier button x
×

RF power amplifier and method for packaging the same

  • US 6,816,011 B2
  • Filed: 05/30/2003
  • Issued: 11/09/2004
  • Est. Priority Date: 09/12/2000
  • Status: Expired due to Term
First Claim
Patent Images

1. An RF power amplifier suitable for transmitting signals in a cellular telephone system comprising:

  • a complimentary metal-oxide semiconductor (CMOS) device;

    a ceramic chip carrier having a top conductive layer, one or more middle conductive layers, and a bottom conductive layer, wherein the top conductive layer is connected to the CMOS device, wherein the ceramic chip carrier includes a plurality of connection points adapted to be mounted to a printed circuit board, and wherein said CMOS device and said ceramic chip carrier are packaged together to form the RF power amplifier;

    one or more signal paths formed between one or more of the connections points of the ceramic chip carrier and one or more signal inputs of the CMOS device, wherein the one or more signal paths extend through all of the conductive layers of the ceramic chip carrier; and

    a plurality of RF amplifier stages, wherein each of the plurality of RF amplifier stages further comprises;

    a first portion having one or more CMOS switching devices implemented in the CMOS device; and

    a second portion having one or more passive elements implemented in the ceramic chip carrier using at least one of said one or more middle conductive layers.

View all claims
  • 9 Assignments
Timeline View
Assignment View
    ×
    ×