Micro-electromechanical devices and methods of manufacture
First Claim
1. A method of manufacturing a micro-electromechanical device having front and back sides, the method comprising:
- providing a substrate comprising a first side located proximate the front side of the device and second side proximate the back side of the device;
providing sacrificial material on a selected area of the first side of the substrate, wherein the sacrificial material is reflowable;
providing a diaphragm layer on the sacrificial material and the first side of the substrate surrounding the sacrificial material in the selected area;
providing at least one transducer on the front side of the device, the transducer located over the sacrificial material, wherein the transducer comprises transducing material and electrical contacts in electrical communication with the transducing material;
forming a void in the substrate from the second side of the substrate towards the first side of the substrate after providing the transducer on the front side of the device, wherein at least a portion of the sacrificial material is exposed within the void proximate the first side of the substrate; and
removing at least a portion of the sacrificial material through the void, wherein a portion of the diaphragm layer is suspended directly above the substrate within the selected area;
wherein the method further comprises reflowing the sacrificial material.
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Abstract
Micro-eletromechanical devices, substrate assemblies from which the devices can be manufactured, and methods to manufacture the devices are disclosed. The invention combines the advantages of conventional surface and bulk micromachining processes using a sacrificial layer to create an integrated micro-electromechanical system (MIEMS) technology that provides high performance, high yield, and manufacturing tolerance. The devices manufactured according to the present invention include, but are not limited to, pressure sensors, vibration sensors, accelerometers, gas or liquid pumps, flow sensor, resonant devices, and infrared detectors.
72 Citations
20 Claims
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1. A method of manufacturing a micro-electromechanical device having front and back sides, the method comprising:
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providing a substrate comprising a first side located proximate the front side of the device and second side proximate the back side of the device;
providing sacrificial material on a selected area of the first side of the substrate, wherein the sacrificial material is reflowable;
providing a diaphragm layer on the sacrificial material and the first side of the substrate surrounding the sacrificial material in the selected area;
providing at least one transducer on the front side of the device, the transducer located over the sacrificial material, wherein the transducer comprises transducing material and electrical contacts in electrical communication with the transducing material;
forming a void in the substrate from the second side of the substrate towards the first side of the substrate after providing the transducer on the front side of the device, wherein at least a portion of the sacrificial material is exposed within the void proximate the first side of the substrate; and
removing at least a portion of the sacrificial material through the void, wherein a portion of the diaphragm layer is suspended directly above the substrate within the selected area;
wherein the method further comprises reflowing the sacrificial material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A substrate assembly having front and back sides, the assembly comprising:
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a substrate comprising a first side located proximate the front side of the device and second side proximate the back side of the substrate assembly;
sacrificial material on the first side of the substrate in a plurality of selected areas, wherein the sacrificial material comprises reflowed sacrificial material;
a diaphragm layer covering the sacrificial material in the selected are the diaphragm layer extending to cover the first side of the substrate surrounding the sacrificial material in the selected areas;
a plurality of transducers on the front side of the device, each of the transducers located over at least a portion of each of the selected areas, wherein the transducer comprises transducing material and electrical contacts in electrical communication with the transducing material;
wherein the sacrificial material in the selected areas is encapsulated between the substrate and the diaphragm layer. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification