Electronic devices with small functional elements supported on a carrier

• US 6,816,380 B2
• Filed: 06/17/2003
• Issued: 11/09/2004
• Est. Priority Date: 05/31/2001
• Status: Expired due to Term

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Stewart, Roger Green, Credelle, Thomas Lloyd, Gengel, Glenn, Joseph, William Hill
• Primary Examiner(s): Martin, David
• Assistant Examiner(s): Levi, Dameon E.
• Application Number:
  US10/464,031
• Publication Number:
  US 20030214792A1
• Time in Patent Office: 511 Days
• Field of Search: 361/736, 361/737, 361/760, 361/761, 361/764, 438/455, 438/19, 257/786
• US Class Current: 361/736
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01Q 1/2208 : associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/10477 : Inverted
• CPC Class Codes: H05K 3/222 : Completing of printed circuits by adding non-printed jumper connections printed jumper connections H05K3/4685
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49204 : Contact or terminal manufacturing

Abstract

Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

Claims

1. An electronic assembly comprising:

a first object created and separated from a host substrate, said first object having a first electrical circuitry therein;

a carrier substrate, said first object deposited in said carrier substrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal connectors, said first object further being recessed below a surface of said carrier substrate; and

a receiving substrate including a second electrical circuitry which is substantially planar, said receiving substrate further including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal connectors, said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad providing an electrical connection between said first electrical circuitry and said second electrical circuitry, wherein the receiving substrate and the carrier substrate are not the same substrate.

2. An electronic assembly as in claim 1 further comprising an insulation layer, said insulation layer insulating said first electronic circuitry and said second electronic circuitry.

3. An electronic assembly as in claim 2 wherein said second electrical circuitry is an antenna.

4. An electronic assembly as in claim 3 wherein said carrier substrate is a flexible strap and wherein said first object comprises a radio frequency circuitry for use in a radio frequency identification tag.

5. An electronic assembly as in claim 1 wherein said carrier substrate is flexible.

6. An electronic assembly as in claim 1 wherein said first object is an integrated circuitry.

7. An electronic assembly as in claim 1 further comprising at least one second object, said second object being recessed within said carrier substrate and being interconnected to said first to said first object using said metal connectors.

8. An electronic assembly as in claim 7 further comprising at least one third object, said third object being coupled to said receiving substrate and being interconnected to said second electrical circuitry using said metal connectors.

9. An electronic assembly as in claim 1 wherein said second electrical circuitry is a printed circuit board.

10. An electronic assembly as in claim 1 wherein said electronic assembly is a multi-feature-size structure in which said carrier substrate is at least five times larger in feature size than said first object and wherein said carrier substrate is at least five times smaller in feature size than said receiving substrate.

11. An electronic assembly as in claim 5 wherein said electronic assembly is a multi-feature-size structure in which said carrier substrate is at least five times larger in feature size than said first object and wherein said carrier substrate is at least five times smaller in feature size than said receiving substrate.

12. An electronic assembly as in claim 11 wherein said carrier substrate couples to said first object through a fluidic self-assembly process.

13. An electronic assembly as in claim 1 wherein said carrier substrate couples to said first object through a fluidic self-assembly process.

14. An electronic assembly as in claim 1 wherein said first carrier connection pad and said second carrier connection pad are the only carrier connection pads on said carrier substrate.

15. An electronic assembly as in claim 12 wherein a conductive adhesive material is used to couple said first carrier connection pad to said first receiving connection pad and said second carrier connection pad to said second receiving connection pad.

16. An electronic assembly comprising:

a first object created and separated from a host substrate, said first object having a first electrical circuitry therein;

a carrier substrate, said first object deposited in said carrier substrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that forms a first interconnection with said first object using metal conductors;

a receiving substrate including a second electrical circuitry which is substantially planar, said receiving substrate further including a first receiving connection pad, and a second receiving connection pad that forms a second interconnection with said second electrical circuitry using said metal conductors, said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad providing an electrical connection between said first electrical circuitry and said second electrical circuitry; and

said first electrical circuitry, said first interconnection, and said second interconnection are essentially coplanar, wherein the receiving substrate and the carrier substrate are not the same substrate.

17. An electronic assembly as in claim 16 wherein each of said first electrical circuitry, said first interconnection, and said second interconnection forms a plane and each of said plane is separated from one another by less than ten micrometers.

18. An electronic assembly as in claim 17 wherein said carrier substrate is flexible.

19. A method of making an electronic assembly comprising:

creating and separating a first object from a host substrate, said first object having a first electrical circuitry therein;

depositing said first object in a carrier substrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal conductors, said first object further being recessed below a surface of said carrier substrate; and

integrating said carrier substrate to a receiving substrate including a second electrical circuitry which is substantially planar and including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal conductors, said integrating providing an electrical connection between said first electrical circuitry and said second electrical circuitry wherein said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad, wherein said carrier substrate and said receiving substrate are not the same substrate.

20. A method of making an electronic assembly as in claim 19 further comprising coating an insulation layer over said metal conductors, said insulation layer to insulate said first electronic circuitry and said second electronic circuitry.

21. A method of making an electronic assembly as in claim 20 further comprising configuring said second electrical circuitry to be an antenna.

22. A method of making an electronic assembly as in claim 21 further comprising configuring said carrier substrate to be a flexible strap wherein said first object comprises a radio frequency circuitry for use in a radio frequency identification tag.

23. A method of making an electronic assembly as in claim 19 further comprising configuring said first object to be an integrated circuitry.

24. A method of making an electronic assembly as in claim 19 further comprising configuring said second electrical circuitry to be a printed circuit board.

25. A method of making an electronic assembly as in claim 19 further comprising making said electronic assembly a multi-feature-size structure wherein said carrier substrate is at least five times larger in feature size than said first object and said carrier substrate is at least five times smaller in feature size than said receiving substrate.

26. A method of making an electronic assembly as in claim 19 wherein said coupling of said carrier substrate to said first functional object is accomplished through a fluidic self-assembly process.

27. A method of making an electronic assembly comprising:

creating and separating a first object from a host substrate, said first object having a first electrical circuitry therein;

depositing said first object to a carrier substrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal conductors;

integrating said carrier substrate to a receiving substrate including a second electrical circuitry which is substantially planar and including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal conductors, said integrating providing an electrical connection between said first electrical circuitry and said second electrical circuitry wherein said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad;

crossing said carrier substrate over at least one of said metal conductors on said receiving substrate; and

configuring said carrier substrate to be at least five times larger in feature size than said first object and at least five times smaller in feature size than said receiving substrate.

28. A method of making an electronic assembly comprising:

creating and separating a first object from a host substrate, said first object having a first electrical circuitry therein;

depositing said first object to a carrier substrate said carrier further comprising a first carrier connection pad and a second carrier connection pad that forms a first interconnection with said first object using metal conductors;

integrating said carrier substrate to a receiving substrate including a second electrical circuitry which is substantially planar, said receiving substrate further including a first receiving connection pad, and a second receiving connection pad that forms a second interconnection with said second electrical circuitry using said metal conductors, said integrating providing an electrical connection between said first electrical circuitry and said second electrical circuitry wherein said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad; and

configuring said first object, said carrier substrate, said receiving substrate, said first interconnection, said second interconnection, and said electrical interconnection to be essentially coplanar.

29. An electronic assembly comprising:

a first object created and separated from a host, said first object having a first electrical circuitry therein;

a carrier substrate, said first object deposited in said carrier substrate through a fluidic self-assembly process, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal connectors, said first object further being recessed below a surface of said carrier substrate; and

a receiving substrate including a second electrical circuitry which is substantially planar, said receiving substrate further including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal connectors, said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad providing an electrical connection between said first electrical circuitry and said second electrical circuitry.

30. An electronic assembly as in claim 29 wherein said carrier substrate is flexible.

31. A method of making an electronic assembly comprising:

creating and separating a first object from a host substrate, said first object having a first electrical circuitry therein;

using a fluidic self-assembly process to deposit said first object in a carrier substrate, said carrier substrate further comprising a first carrier connection pad and a second carrier connection pad that interconnect with said first object using metal conductors, said first object further being recessed below a surface of said carrier substrate; and

integrating said carrier substrate to a receiving substrate including a second electrical circuitry which is substantially planar and including a first receiving connection pad, and a second receiving connection pad that interconnect with said second electrical circuitry using said metal conductors, said integrating providing an electrical connection between said first electrical circuitry and said second electrical circuitry wherein said first receiving connection pad couples to said first carrier connection pad and said second receiving connection pad couples to said second carrier connection pad.