Integrated circuit inductors
First Claim
1. An integrated circuit comprising:
- a coated substrate having a circuit formed on the coated substrate and having a plurality of substantially parallel perforations; and
a coil routed through the plurality of substantially parallel perforations, and the coil operably coupled to the circuit.
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Accused Products
Abstract
The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.
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Citations
36 Claims
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1. An integrated circuit comprising:
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a coated substrate having a circuit formed on the coated substrate and having a plurality of substantially parallel perforations; and
a coil routed through the plurality of substantially parallel perforations, and the coil operably coupled to the circuit. - View Dependent Claims (2, 3)
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4. An integrated circuit comprising:
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a substrate having a coating and a plurality of parallel perforations that connect two sides of the substrate;
a circuit formed on the substrate;
first coil segments routed through the plurality of substantially parallel perforations;
second coil segments connecting the first coils segments to form a coil; and
wherein the coil is operably coupled to the circuit. - View Dependent Claims (5, 6, 7, 8, 9)
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10. An integrated circuit comprising:
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a substrate having a plurality of parallel through-perforations;
a conductive path passing through the through perforations and around first and second sides of the substrate;
a circuit formed on the substrate and connected to the conductive path. - View Dependent Claims (11, 12, 13, 14)
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15. An integrated circuit comprising:
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a substrate having first and second regions;
a magnetic film covering a portion of the first region of the substrate;
a plurality of parallel perforations formed in the first region of the substrate;
a coil formed in the first region by routing one or more conductors through the parallel perforations and around first and second sides of the substrate; and
a circuit formed in the second region and electrically connected to the coil. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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22. An integrated circuit comprising:
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a substrate;
a coating covering a portion of the substrate;
first and second parallel rows of parallel perforations formed in the substrate;
a conductive path formed by passing a conductor through the first and second parallel rows of parallel perforations to form a coil, with a portion of the coil surrounding the coating;
leads connected to the coil; and
a circuit connected to the leads. - View Dependent Claims (23, 24, 25, 26, 27)
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28. An integrated circuit comprising:
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a semiconductor substrate;
a magnetic film covering a first select region of the substrate;
parallel perforations formed in the substrate so as to partially surrounding the magnetic film;
first conductive segments formed in the parallel perforations so as to connect first and second substrate surfaces;
second conductive segments connected to the first conductive segments to form a coil surrounding a select volume of the semiconductor and surrounding the magnetic film; and
a circuit formed in a second select region of the substrate and connected to the coil. - View Dependent Claims (29, 30)
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31. An integrated circuit comprising:
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a substrate;
a coating covering a portion of the substrate;
first and second rows of parallel perforations connected opposite sides of the substrate and surrounding first and second sides of the coating;
a coil routed through the parallel perforations so as to enclose a volume portion of the substrate and the coating; and
a circuit operatively connected to the coil. - View Dependent Claims (32, 33, 34, 35, 36)
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Specification