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Method of forming a field effect transistor having a lateral depletion structure

  • US 6,818,513 B2
  • Filed: 12/18/2003
  • Issued: 11/16/2004
  • Est. Priority Date: 01/30/2001
  • Status: Expired due to Term
First Claim
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1. A method of forming a field effect transistor device comprising:

  • forming a well region of a second conductivity type in a semiconductor substrate of a first conductivity type, the semiconductor substrate having a major surface and a drain region;

    forming a source region of the first conductivity type in the well region;

    forming a trench gate electrode adjacent to the source region;

    forming a stripe trench extending from the major surface of the semiconductor substrate into the semiconductor substrate to a predetermined depth; and

    depositing a semiconductor material of the second conductivity type within the stripe trench.

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