Method for manufacturing raised electrical contact pattern of controlled geometry
First Claim
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1. An electronic assembly comprising:
- a semiconductor die having a plurality of terminals; and
a plurality of resilient, springable interconnection elements, each of the interconnection elements having a die end attached directly to a respective one of the terminals on the die, an elongate section between the die end and a contact end, and a tip on the contact end, the tip pointing away from the die, wherein the interconnection elements include a precursor element and an overcoat material covering said precursor element, wherein the precursor element is of a flexible, substantially non-resilient material and the overcoat material provides the resilient springability of the interconnection element.
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Abstract
Spring contact elements are attached to terminals of an electronic component, which may be a semiconductor die. The spring contact elements may comprise a flexible precursor element. The precursor element may be over coated with a resilient material. The spring contact elements may be elongate and attached to the terminals at one end. The other end of the spring contacts may be spaced away from the electronic component.
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Citations
20 Claims
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1. An electronic assembly comprising:
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a semiconductor die having a plurality of terminals; and
a plurality of resilient, springable interconnection elements, each of the interconnection elements having a die end attached directly to a respective one of the terminals on the die, an elongate section between the die end and a contact end, and a tip on the contact end, the tip pointing away from the die, wherein the interconnection elements include a precursor element and an overcoat material covering said precursor element, wherein the precursor element is of a flexible, substantially non-resilient material and the overcoat material provides the resilient springability of the interconnection element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An electronic assembly comprising:
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a semiconductor die having a plurality of terminals; and
a plurality of resilient, springable interconnection elements, each of the interconnection elements including a precursor element of a flexible, non-resilient material and an overcoat material covering said precursor element, the overcoat material providing the resilient springability of the interconnection element, and having a die end attached directly to a respective one of the terminals on the die, an elongate section extending from the die end to a contact end, the elongate section including at least a first bend and a second bend, and a tip on the contact end, the tip pointing away from the die. - View Dependent Claims (11)
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12. An electronic assembly comprising:
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a semiconductor die having a plurality of terminals; and
a plurality of resilient, springable interconnection elements, each of the interconnection elements having a die end attached directly to a respective one of the terminals on the die, an elongate section between the die end and a contact end, and a tip on the contact end, wherein the interconnection elements include a precursor element and an overcoat material covering said precursor element, the precursor element is of a flexible, substantially non-resilient material and the overcoat material provides the resilient springability of the interconnection element. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification