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Ball grid array package with shielding

  • US 6,818,978 B1
  • Filed: 11/19/2002
  • Issued: 11/16/2004
  • Est. Priority Date: 11/19/2002
  • Status: Active Grant
First Claim
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1. An integrated circuit package comprising:

  • a substrate having first and second surfaces and a plurality of conductive traces therebetween;

    a stacked semiconductor die apparatus coupled to said substrate, said stacked semiconductor die apparatus comprising a first semiconductor die, a second semiconductor die stacked on said first semiconductor die and a metallic shield disposed between the first and second semiconductor dice, the first semiconductor die being mounted on said first surface of said substrate, the metallic shield being larger than both the first semiconductor die and the second semiconductor die for shielding radio frequency interference signals or electromagnetic interference signals to or from the first semiconductor die, the stacked semiconductor die apparatus further comprising a spacer fixed to said first semiconductor die, an opposing side of said spacer being fixed to said metallic shield;

    a plurality of wire bonds connecting said first and second semiconductor dice to ones of said conductive traces of said substrate;

    at least one encapsulating material for encapsulating said wire bonds, said first semiconductor die and said second semiconductor die; and

    a ball grid array disposed on said second surface of said substrate, bumps of said ball grid array being in electrical connection with ones of said conductive traces;

    wherein said second semiconductor die is fixed directly to said metallic shield.

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