Ball grid array package with shielding
First Claim
1. An integrated circuit package comprising:
- a substrate having first and second surfaces and a plurality of conductive traces therebetween;
a stacked semiconductor die apparatus coupled to said substrate, said stacked semiconductor die apparatus comprising a first semiconductor die, a second semiconductor die stacked on said first semiconductor die and a metallic shield disposed between the first and second semiconductor dice, the first semiconductor die being mounted on said first surface of said substrate, the metallic shield being larger than both the first semiconductor die and the second semiconductor die for shielding radio frequency interference signals or electromagnetic interference signals to or from the first semiconductor die, the stacked semiconductor die apparatus further comprising a spacer fixed to said first semiconductor die, an opposing side of said spacer being fixed to said metallic shield;
a plurality of wire bonds connecting said first and second semiconductor dice to ones of said conductive traces of said substrate;
at least one encapsulating material for encapsulating said wire bonds, said first semiconductor die and said second semiconductor die; and
a ball grid array disposed on said second surface of said substrate, bumps of said ball grid array being in electrical connection with ones of said conductive traces;
wherein said second semiconductor die is fixed directly to said metallic shield.
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Accused Products
Abstract
An integrated circuit package is provided. The package has a substrate having first and second surfaces and a plurality of conductive traces therebetween. A stacked semiconductor die apparatus is coupled to the substrate. The stacked semiconductor die apparatus includes a first semiconductor die, a second semiconductor die stacked on the first semiconductor die and a shield disposed between the first and second semiconductor dice. A plurality of wire bonds connect the first and second semiconductor dice to ones of the conductive traces of the substrate. At least one encapsulating material encapsulates the wire bonds, the first semiconductor die and the second semiconductor die. A ball grid array is disposed on the second surface of the substrate such that bumps of the ball grid array are in electrical connection with ones of the conductive traces.
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Citations
15 Claims
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1. An integrated circuit package comprising:
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a substrate having first and second surfaces and a plurality of conductive traces therebetween;
a stacked semiconductor die apparatus coupled to said substrate, said stacked semiconductor die apparatus comprising a first semiconductor die, a second semiconductor die stacked on said first semiconductor die and a metallic shield disposed between the first and second semiconductor dice, the first semiconductor die being mounted on said first surface of said substrate, the metallic shield being larger than both the first semiconductor die and the second semiconductor die for shielding radio frequency interference signals or electromagnetic interference signals to or from the first semiconductor die, the stacked semiconductor die apparatus further comprising a spacer fixed to said first semiconductor die, an opposing side of said spacer being fixed to said metallic shield;
a plurality of wire bonds connecting said first and second semiconductor dice to ones of said conductive traces of said substrate;
at least one encapsulating material for encapsulating said wire bonds, said first semiconductor die and said second semiconductor die; and
a ball grid array disposed on said second surface of said substrate, bumps of said ball grid array being in electrical connection with ones of said conductive traces;
whereinsaid second semiconductor die is fixed directly to said metallic shield. - View Dependent Claims (2)
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3. An integrated circuit package comprising:
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a substrate having first and second surfaces and a plurality of conductive traces therebetween;
a stacked semiconductor die apparatus coupled to said substrate, said stacked semiconductor die apparatus comprising a first semiconductor die, a second semiconductor die stacked on said first semiconductor die and a metallic shield disposed between the first and second semiconductor dice, said first semiconductor die being mounted on said first surface of said substrate, the metallic shield being larger than both the first semiconductor die and the second semiconductor die for shielding radio frequency interference signals or electromagnetic interference signals to or from the first semiconductor die;
a plurality of wire bonds connecting said first and second semiconductor dice to ones of said conductive traces of said substrate;
at least one encapsulating material for encapsulating said wire bonds, said first semiconductor die and said second semiconductor die; and
a ball grid array disposed on said second surface of said substrate, bumps of said ball grid array being in electrical connection with ones of said conductive traces;
whereinsaid stacked semiconductor die apparatus further comprises at least one spacer fixed to said first surface of said substrate, said metallic shield being mounted on said at least one spacer such that said metallic shield is spaced from said first semiconductor die. - View Dependent Claims (4, 5)
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6. An integrated circuit package comprising:
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a substrate having first and second surfaces and a plurality of conductive traces therebetween;
a stacked semiconductor die apparatus coupled to the substrate, the stacked semiconductor die apparatus comprising a first semiconductor die mounted on the first surface of the substrate, a second semiconductor die stacked on said first semiconductor die and a metallic shield disposed between the first and second semiconductor dice, the metallic shield being mounted on a pair of spacers mounted on said substrate on either side of said first semiconductor die, the pair of spacers being mounted on said first surface of said substrate, such that the metallic shield is spaced from the first semiconductor die;
a plurality of wire bonds connecting said first and second semiconductor dice to ones of said conductive traces of said substrate;
at least one encapsulating material for encapsulating said wire bonds, said first semiconductor die and said second semiconductor die; and
a ball grid array disposed on said second surface of said substrate, bumps of said ball grid array being in electrical connection with ones of said conductive traces.
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7. An integrated circuit package comprising:
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a substrate having first and second surfaces and a plurality of conductive traces therebetween;
a stacked semiconductor die apparatus coupled to the substrate, the stacked semiconductor die apparatus comprising a first semiconductor die mounted on the first surface of the substrate, a second semiconductor die stacked on said first semiconductor die, a metallic shield disposed between the first and second semiconductor dice, the metallic shield being mounted on a plurality of spacers mounted on said substrate, around said first semiconductor die, said plurality of spacers being mounted on said first surface of said substrate, such that the metallic shield is spaced from the first semiconductor die;
a plurality of wire bonds connecting said first and second semiconductor dice to ones of said conductive traces of said substrate;
at least one encapsulating material for encapsulating said wire bonds, said first semiconductor die and said second semiconductor die; and
a ball grid array disposed on said second surface of said substrate, bumps of said ball grid array being in electrical connection with ones of said conductive traces.
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8. An integrated circuit package comprising:
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a substrate having first and second surfaces, a plurality of conductive traces therebetween and a cavity therein;
a stacked semiconductor die apparatus coupled to said substrate, said stacked semiconductor die apparatus comprising a first semiconductor die, a second semiconductor die stacked on said first semiconductor die and a metallic shield disposed between the first and second semiconductor die, a portion of said metallic shield being mounted on said first surface of said substrate such that said metallic shield being is disposed over said cavity, and said first semiconductor die being mounted to a first surface of said metallic shield whereby said first semiconductor die is disposed in said cavity, the metallic shield being larger than both the first semiconductor die and the second semiconductor die for shielding radio frequency interference signals or electromagnetic interference signals to or from the first semiconductor die;
a plurality of wire bonds connecting said first and second semiconductor dice to ones of said conductive traces of said substrate;
at least one encapsulating material for encapsulating said wire bonds, said first semiconductor die and said second semiconductor die; and
a ball grid array disposed on said second surface of said substrate, bumps of said ball grid array being in electrical connection with ones of said conductive traces;
whereinsaid second semiconductor die is mounted directly on an opposing surface of said metallic shield. - View Dependent Claims (9)
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10. An integrated circuit package comprising:
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a substrate having first and second surfaces, a plurality of conductive traces therebetween and a cavity therein;
a stacked semiconductor die apparatus coupled to said substrate, said stacked semiconductor die apparatus comprising a first semiconductor die, a second semiconductor die stacked on said first semiconductor die and a metallic shield disposed between the first and second semiconductor dice, a portion of said metallic shield being mounted on said first surface of said substrate such that said metallic shield being is disposed over said cavity, and said first semiconductor die being mounted to a first surface of said metallic shield whereby said first semiconductor die is disposed in said cavity, the metallic shield being larger than both the first semiconductor die and the second semiconductor die for shielding radio frequency interference signals or electromagnetic interference signals to or from the first semiconductor die;
a plurality of wire bonds connecting said first and second semiconductor dice to ones of said conductive traces of said substrate;
at least one encapsulating material for encapsulating said wire bonds, said first semiconductor die and said second semiconductor die; and
a ball grid array disposed on said second surface of said substrate, bumps of said ball grid array being in electrical connection with ones of said conductive traces;
whereinsaid second semiconductor die is mounted on an opposing surface of said metallic shield, and wherein said at least one encapsulating material comprises a first encapsulant surrounding the first semiconductor die, and a second encapsulant surrounding the second semiconductor die. - View Dependent Claims (11)
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12. An integrated circuit package comprising:
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a substrate having first and second surfaces and a plurality of conductive traces therebetween, the substrate further having a cavity therein;
a stacked semiconductor die apparatus coupled to said substrate, said stacked semiconductor die apparatus comprising a first semiconductor die, a second semiconductor die stacked on said first semiconductor die and a metallic shield disposed between the first and second semiconductor dice, a portion of said metallic shield being mounted on said first surface of said substrate such that said metallic shield is disposed over said cavity, and said first semiconductor die is mounted to a first surface of said metallic shield whereby said first semiconductor die is disposed in said cavity;
a second metallic shield coupled to said second surface of said substrate and covering said cavity;
a plurality of wire bonds connecting said first and second semiconductor dice to ones of said conductive traces of said substrate;
at least one encapsulating material for encapsulating said wire bonds, said first semiconductor die and said second semiconductor die;
a ball grid array disposed on said second surface of said substrate, bumps of said ball grid array being in electrical connection with ones of said conductive traces, said second semiconductor die is mounted on an opposing surface of said metallic shield. - View Dependent Claims (13, 14, 15)
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Specification