Embedded antenna and semiconductor die on a substrate in a laminate package

• US 6,818,985 B1
• Filed: 12/22/2001
• Issued: 11/16/2004
• Est. Priority Date: 12/22/2001
• Status: Active Grant

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Megahed, Mohamed A., Walley, John S., Coccioli, Roberto, Trinh, Trang N., Vittorini, Larry D.
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US10/026,134
• Time in Patent Office: 1,060 Days
• Field of Search: 257/728, 257/725, 257/724, 257/734, 257/737, 257/738, 257/668, 257/421, 257/240, 257/700, 257/701, 257/702, 257/784, 257/685, 257/723, 257/588, 257/684, 343/700.MS, 343/767, 361/720
• US Class Current: 257/728
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48684 Tungsten (W) as principal constituent
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/48724 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48784 Tungsten (W) as principal constituent
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85424 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/8548 Molybdenum (Mo) as principal constituent
• CPC Class Codes: H01L 2224/85484 Tungsten (W) as principal constituent
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49822 : Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 : Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 : Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.

Claims

1. A structure comprising:

a laminate substrate having a top surface for receiving a semiconductor die;

an antenna element situated on said top surface of said laminate substrate, said antenna element coupled to a laminate substrate bond pad, said antenna element being coupled to said laminate substrate by a trace on said top surface of said laminate substrate;

a bonding wire providing an electrical connection between said laminate substrate bond pad and a semiconductor die bond pad;

wherein a bottom surface of said laminate substrate is suitable for being electrically connected to a printed circuit board.

2. The structure of claim 1 wherein an input impedance of said antenna element matches an output impedance at said semiconductor die bond pad.

3. The structure of claim 1 wherein said antenna element comprises copper.

4. The structure of claim 1 wherein said antenna element comprises a square metal pad.

5. The structure of claim 1 wherein said antenna element is selected from the group consisting of a slot line pattern, a meander line pattern, and a patch pattern.

6. The structure of claim 1 wherein said laminate substrate comprises an organic laminate material.

7. The structure of claim 1 wherein said laminate substrate comprises a ceramic laminate material.

8. The structure of claim 1 further comprising a capacitor, said capacitor coupled to said antenna element.

9. The structure of claim 8 wherein said capacitor is an embedded capacitor.

10. A structure comprising:

a laminate substrate having a top surface;

a first semiconductor die and a second semiconductor die attached to said top surface of said laminate substrate;

a first antenna element situated on said top surface of said laminate substrate, said first antenna element coupled to a first laminate substrate bond pad;

a second antenna element situated on said top surface of said laminate substrate, said second antenna element coupled to a second laminate substrate bond pad;

a first bonding wire providing an electrical connection between said first laminate substrate bond pad and a semiconductor die bond pad on said first semiconductor die;

a second bonding wire providing an electrical connection between said second laminate substrate bond pad and a semiconductor die bond pad on said second semiconductor die;

wherein a bottom surface of said laminate substrate is suitable for being electrically connected to a painted circuit board.

11. The structure of claim 10 wherein said first antenna element is coupled to said first laminate substrate bond pad by a trace on said top surface of said laminate substrate.

12. The structure of claim 10 wherein an input impedance of said first antenna element matches an output impedance at said semiconductor die bond pad on said first semiconductor die.

13. The structure of claim 10 wherein said second antenna element is coupled to said second laminate substrate bond pad by a trace on said top surface of said laminate substrate.

14. The structure of claim 10 wherein an input impedance of said second antenna element matches an output impedance at said semiconductor die bond pad on said second semiconductor die.

15. The structure of claim 10 wherein said first antenna element comprises copper.

16. The structure of claim 10 wherein said first antenna element is selected from the group consisting of a slot line pattern, a meander line pattern, and a patch pattern.

17. The structure of claim 10 wherein said second antenna element is selected from the group consisting of a slot line pattern, a meander line pattern, and a patch pattern.

18. The structure of claim 10 wherein said laminate substrate comprises an organic laminate material.

19. The structure of claim 10 further comprising a capacitor, said capacitor coupled to said first antenna element.