Embedded antenna and semiconductor die on a substrate in a laminate package
First Claim
1. A structure comprising:
- a laminate substrate having a top surface for receiving a semiconductor die;
an antenna element situated on said top surface of said laminate substrate, said antenna element coupled to a laminate substrate bond pad, said antenna element being coupled to said laminate substrate by a trace on said top surface of said laminate substrate;
a bonding wire providing an electrical connection between said laminate substrate bond pad and a semiconductor die bond pad;
wherein a bottom surface of said laminate substrate is suitable for being electrically connected to a printed circuit board.
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Accused Products
Abstract
According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.
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Citations
19 Claims
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1. A structure comprising:
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a laminate substrate having a top surface for receiving a semiconductor die;
an antenna element situated on said top surface of said laminate substrate, said antenna element coupled to a laminate substrate bond pad, said antenna element being coupled to said laminate substrate by a trace on said top surface of said laminate substrate;
a bonding wire providing an electrical connection between said laminate substrate bond pad and a semiconductor die bond pad;
wherein a bottom surface of said laminate substrate is suitable for being electrically connected to a printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A structure comprising:
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a laminate substrate having a top surface;
a first semiconductor die and a second semiconductor die attached to said top surface of said laminate substrate;
a first antenna element situated on said top surface of said laminate substrate, said first antenna element coupled to a first laminate substrate bond pad;
a second antenna element situated on said top surface of said laminate substrate, said second antenna element coupled to a second laminate substrate bond pad;
a first bonding wire providing an electrical connection between said first laminate substrate bond pad and a semiconductor die bond pad on said first semiconductor die;
a second bonding wire providing an electrical connection between said second laminate substrate bond pad and a semiconductor die bond pad on said second semiconductor die;
wherein a bottom surface of said laminate substrate is suitable for being electrically connected to a painted circuit board. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification