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Housing for electronic apparatus having outer wall formed by injection molding

  • US 6,819,547 B2
  • Filed: 02/25/2002
  • Issued: 11/16/2004
  • Est. Priority Date: 03/07/2001
  • Status: Expired due to Fees
First Claim
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1. A housing configured to house a functional part, comprising:

  • a support wall configured to support the functional part, and formed by injecting a metal material from a plurality of gates into a molding space in a metal die, wherein said support wall includes a first end portion situated on an upstream end along a flowing direction of the metal material, a second end portion situated on a downstream end of the flowing direction of the metal material, and an injection portion formed on the first end portion where said plurality of gates of the metal die are situated, forming a space between the first end portion and the injection portion, said injection portion includes first and second edge portions that extend from the first end portion towards the second end portion and facing each other and a third edge portion bridged between a distal end of the first end portion and a distal end of the second edge portion; and

    a synthetic-resin made cover configured to cover the injection portion of the support wall, the cover being fixed to the support wall by a plurality of locations along the first edge portion to the third edge portion of the injection portion.

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