Substrate and method of forming substrate for fluid ejection device

• US 6,821,450 B2
• Filed: 01/21/2003
• Issued: 11/23/2004
• Est. Priority Date: 01/21/2003
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Monroe, Michael, Haluzak, Charles C., Truninger, Martha A.
• Primary Examiner(s): Norton, Nadine G.
• Assistant Examiner(s): Ahmed, Shamim
• Application Number:
  US10/347,888
• Publication Number:
  US 20040141027A1
• Time in Patent Office: 672 Days
• Field of Search: 216/2, 216/11, 216/17, 216/27, 216/41, 216/74, 216/79, 347/63, 347/65, 438/21, 438/689
• US Class Current: 216/27
• CPC Class Codes: B41J 2/1601 Production of bubble jet print heads B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/1607 Production of print heads with piezoelectric elements B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1634 laser machining

Abstract

A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.

Claims

1. A method of forming an opening through a substrate having a first side and a second side opposite the first side, the method comprising:

forming a trench in the first side of the substrate;

forming a mask layer within the trench;

forming at least one hole in the mask layer;

filling the trench and the at least one hole in the mask layer;

forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer; and

forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.

2. The method of claim 1, wherein the substrate is formed of silicon.

3. The method of claim 1, wherein forming the trench in the first side of the substrate includes etching into the substrate from the first side.

4. The method of claim 1, wherein forming the mask layer within the trench includes at least one of growing and depositing an etch resistant material within the trench.

5. The method of claim 4, wherein the etch resistant material includes one of an oxide, a nitride, an oxynitride, and silicon carbide.

6. The method of claim 1, wherein forming the at least one hole in the mask layer includes etching into the mask layer from the first side of the substrate.

7. The method of claim 1, wherein forming the at least one hole in the mask layer includes patterning the mask layer.

8. The method of claim 1, wherein filling the trench and the at least one hole includes redefining the first side of the substrate.

9. The method of claim 1, wherein filling the trench includes embedding the mask layer.

10. The method of claim 1, wherein filling the trench includes filling the trench with one of an amorphous material, an amorphous silicon material, and a polycrystalline silicon material.

11. The method of claim 1, wherein forming the first portion of the opening in the substrate includes one of etching and laser machining into the substrate.

12. The method of claim 11, wherein forming the second portion of the opening in the substrate includes etching through the at least one hole in the mask layer.

13. A method of forming a substrate for a fluid ejection device, the method comprising:

forming a trench in a first side of the substrate;

forming a mask layer within the trench;

forming at least one hole in the mask layer;

filling the trench and the at least one hole in the mask layer; and

forming a fluid opening through the substrate, including forming a fluid channel in the substrate from a second side of the substrate opposite the first side to the mask layer and forming a fluid feed hole in the substrate through the at least one hole in the mask layer to the first side of the substrate.

14. The method of claim 13, wherein the substrate is formed of silicon.

15. The method of claim 13, wherein forming the trench in the first side of the substrate includes etching into the substrate from the first side.

16. The method of claim 13, wherein forming the mask layer within the trench includes at least one of growing and depositing an etch resistant material within the trench.

17. The method of claim 16, wherein the etch resistant material includes one of an oxide, a nitride, an oxynitride, and silicon carbide.

18. The method of claim 13, wherein forming the at least one hole in the mask layer includes etching into the mask layer from the first side of the substrate.

19. The method of claim 13, wherein forming the at least one hole in the mask layer includes patterning the mask layer.

20. The method of claim 13, wherein filling the trench and the at least one hole includes redefining the first side of the substrate.

21. The method of claim 13, wherein filling the trench includes embedding the mask layer.

22. The method of claim 13, wherein filling the trench includes filling the trench with one of an amorphous material, an amorphous silicon material, and a polycrystalline silicon material.

23. The method of claim 13, wherein forming the fluid channel in the substrate includes one of etching and laser machining into the substrate.

24. The method of claim 23, wherein forming the fluid feed hole in the substrate includes etching through the at least one hole in the mask layer.