Method of identifying wafer cutting positions of different size partial wafers

• US 6,821,866 B2
• Filed: 03/11/2003
• Issued: 11/23/2004
• Est. Priority Date: 03/11/2003
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Subramanian, Balamurugan
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): Yevsikov, Victor V
• Application Number:
  US10/386,240
• Publication Number:
  US 20040180513A1
• Time in Patent Office: 623 Days
• Field of Search: 438/460, 438/461, 438/462, 438/463, 438/464
• US Class Current: 438/460
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 2223/54466 Located in a dummy or reference die

Abstract

A tool and method is described to decide partial wafer sizes to process multiple random sizes of wafers in pick and place equipment for wafermap operation. The tool identifies the wafer and gets wafermap data. The position of one or more cutters is displayed. The position of the cutters relative to the wafer is displayed. The tool generates and displaying the results of the type of dies in each partial that would result from a cut according to said displayed position of the cutters.

Claims

1. A method of determining the cut position for a partial wafer comprising the steps of:

getting wafermap data;

displaying wafermap data,

displaying cutter coordinates; and

moving displayed cutter coordinates relative to the wafermap and generating bin details for resultant partial wafer that results from cuts at displayed cutter position.

2. The method of claim 1 including the step of getting wafer identification information.

3. The method of claim 1 including displaying the coordinates of a pair of orthogonal cutters and moving the displayed pair of cutters to get bin details.

4. A method for deciding and providing a partial wafer size for production demands comprises the steps of:

getting wafermap data,

displaying the coordinates of the one or more cutters relative to the wafer to be cut,

and moving the displayed coordinates of said one or more cutters relative to the wafer and generating bin details of resultant partial wafer.

5. The method of claim 4 including the step of getting the wafer identification through a keyboard.

6. A method for deciding and providing a partial wafer size for production demands comprising the steps of:

displaying the coordinates of a pair of orthogonal oriented wafer cutters relative to a wafer or partial wafer,

getting wafermap data of good dies;

moving the displayed position of the cutters relative to the wafer; and

generating and displaying the results of the type of dies in each partial wafer that would result from the cut according to said wafermap data.

7. A method for deciding and providing a partial wafer size for production demands comprising the steps of:

identifying the wafer;

getting the wafermap data;

automatically querying the user for the number of good dies wanted and the type of partial wafer selected; and

automatically displaying the cut position coordinates for one or more cutters.

8. A tool for deciding and providing a partial wafer size for production comprising:

means for getting wafer identification;

means for getting wafermap data;

means for determining the position of the one or more cutters ;

and

means for moving the displayed position of the cutters relative to the wafer and generating and displaying the results of the type of dies in each partial that would result from a cut according to said displayed position of the cutters.

9. The tool of claim 8 wherein said cutters are two and they are orthogonal to each other.

10. A tool for deciding and providing a partial wafer size for production comprising:

means for identifying the wafer;

means foe getting the wafermap data;

means for automatically querying the user for the number of good dies wanted and the type of partial wafer selected; and

said tool automatically deciding and displaying the cut position or one or more cutters based o the number of good dies wanted and the type of partial wafer selected.