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Method of identifying wafer cutting positions of different size partial wafers

  • US 6,821,866 B2
  • Filed: 03/11/2003
  • Issued: 11/23/2004
  • Est. Priority Date: 03/11/2003
  • Status: Active Grant
First Claim
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1. A method of determining the cut position for a partial wafer comprising the steps of:

  • getting wafermap data;

    displaying wafermap data, displaying cutter coordinates; and

    moving displayed cutter coordinates relative to the wafermap and generating bin details for resultant partial wafer that results from cuts at displayed cutter position.

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