Thermally-conductive electrically-insulating polymer-base material

• US 6,822,018 B2
• Filed: 02/15/2002
• Issued: 11/23/2004
• Est. Priority Date: 02/15/2002
• Status: Expired due to Term

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Myers, Bruce A., Chaudhuri, Arun K.
• Primary Examiner(s): Yoon, Tae H.
• Application Number:
  US10/075,978
• Publication Number:
  US 20030158294A1
• Time in Patent Office: 1,012 Days
• Field of Search: 523/210, 523/200, 524/404, 524/424, 524/428, 174/16.3, 174/17.SF
• US Class Current: 523/210
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08K 9/10 Encapsulated ingredients
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Abstract

An electrically-insulating polymer-based material with improved thermal conductvity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.

Claims

1. A polymer-based material comprising:

a polymer matrix material; and

metal particles dispersed in the matrix material; and

a dielectric coating individually encapsulating each of the metal particles so as to electrically insulate the metal particles from each other, the dielectric coating being insoluble in the matrix material and having a softening temperature below the melting temperature of the metal particles.

2. The polymer-based material according to claim 1, wherein the matrix material is formed of an epoxy, silicone, or polyurethane.

3. The polymer-based material according to claim 1, wherein the metal particles are formed of copper, aluminum or silver.

4. The polymer-based material according to claim 1, further comprising dielectric particles dispersed in the matrix material, the dielectric particles having a higher coefficient of thermal conductivity than the matrix material.

5. The polymer-based material according to claim 4, wherein the dielectric particles are formed of a ceramic material.

6. The polymer-based material according to claim 4, wherein the dielectric coating comprises second dielectric particles dispersed therein, the second dielectric particles being smaller than the dielectric particles dispersed in the matrix material.

7. The polymer-based material according to claim 6, wherein the second dielectric particles are formed of a ceramic material having a higher coefficient of thermal conductivity than the matrix material.

8. The polymer-based material according to claim 1, wherein the dielectric coating is a polymer having a softening temperature of at least 175°

C.

9. The polymer-based material according to claim 1, wherein the dielectric coating comprises dielectric particles dispersed therein.

10. The polymer-based material according to claim 9, wherein the dielectric particles are formed of a ceramic material having a higher coefficient of thermal conductivity than the matrix material.

11. The polymer-based material according to claim 1, wherein the polymer-based material is an adhesive that bonds a heat-generating power device to a substrate.

12. The polymer-based material according to claim 1, wherein the polymer-based material encases a heat-generating power device.

13. An adhesive material contacting a heat-generating electronic device, the adhesive material comprising:

about 50 to about 80 weight percent of metal particles having a melting temperature above a maximum operating temperature of the heat-generating electronic device;

a dielectric polymer coating individually encapsulating each of the metal particles so as to electrically insulate the metal particles from each other, the polymer coating having a softening temperature of at least the maximum operating temperature of the heat-generating electronic device but below the melting temperature of the metal particles;

about 0.5 to about 10 weight percent of dielectric particles; and

the balance essentially a polymeric gel in which the metal particles and the dielectric particles are dispersed, the dielectric particles having a higher coefficient of thermal conductivity than the gel.

14. The adhesive material according to claim 13, wherein the dielectric particles are formed of alumina, boron nitride, aluminum nitride, silicon carbide and/or silicon nitride.

15. The adhesive material according to claim 13, wherein the dielectric polymer coating comprises about 50 to about 90 weight percent of second dielectric particles dispersed therein, the second dielectric particles having a higher coefficient of thermal conductivity than the gel.

16. The adhesive material according to claim 15, wherein the second dielectric particles are formed of alumina, boron nitride, aluminum nitride, silicon carbide and/or silicon nitride.

17. The adhesive material according to claim 15, wherein the second dielectric particles are smaller than the dielectric particles dispersed in the gel.

18. The adhesive material according to claim 13, wherein the gel is an epoxy, or polyurethane.

19. The adhesive material according to claim 13, wherein the adhesive material bonds the heat-generating electronic device to a substrate.

20. The adhesive material according to claim 13, wherein the adhesive material encases the heat-generating electronic device.