Embedded electromagnetic interference shield

• US 6,822,879 B2
• Filed: 08/06/2002
• Issued: 11/23/2004
• Est. Priority Date: 08/06/2002
• Status: Expired due to Fees

• Current Assignee: Sumitomo Electric Device Innovations, U.S.A., Inc. (Sumitomo Corporation)
• Original Assignee: Emcore Corporation
• Inventors: Babic, Dubravko, Kraus, Herbert, Rathnam, Lakshman
• Primary Examiner(s): Patel, Tulsidas
• Assistant Examiner(s): Bui, Hung S.
• Application Number:
  US10/213,540
• Publication Number:
  US 20040027818A1
• Time in Patent Office: 840 Days
• Field of Search: 361/818, 361/816, 361/800, 361/753, 361/787, 174/35, 174/51.R, 439/607, 439/939
• US Class Current: 361/818
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: H01R 13/6582 with resilient means for engaging mating connector
• CPC Class Codes: H01R 13/741 using snap fastening means
• CPC Class Codes: H05K 9/0058 specially adapted for optoelectronic applications
• CPC Class Codes: Y10S 439/939 with grounding to metal mounting panel

Abstract

An improved electromagnetic interference shield for a module includes springs in which the compression force pushes the springs in a direction that is approximately parallel to the optic axis. The springs allow significantly looser tolerances on the placement of the module on its associated printed circuit board. The shield also includes an opening near its center, the edge of which includes a plurality of teeth. When the shield is placed onto the module, the teeth bend along the negative optic axis direction and prevent the shield from being pulled away from the module. Accidental removal of the shield is thus prevented. The shield splits the enclosure ground from the internal signal ground, decreasing the capacitance between them, in turn decreasing another possible source of electromagnetic radiation. In addition, the shield is more cost efficient to manufacture since it only requires a one step assembly process.

Claims

1. An electromagnetic interference (EMI) shield, comprising:

an outer edge, the outer edge comprising a plurality of springs, each of the plurality of springs comprising bent tips;

an opening proximate to a center of the shield, the opening comprising a plurality of teeth at an edge of the opening, wherein the plurality of teeth is configured to contact a module; and

a plurality of extensions at the outer edge, wherein each extension resides between two of the plurality of springs, wherein the extensions reduce gaps between the springs.

2. The shield of claim 1, wherein the plurality of teeth are configured to provide a Tinnerman-type coupling with the module.

3. The shield of claim 1, wherein the shield is comprised of a sheet of metal.

4. The shield of claim 1, wherein the bent tips contact an enclosure faceplate when the module resides on a printed circuit board.

5. The shield of claim 1, wherein the bent tips comprise a spring force in a direction approximately parallel to an optic axis.

6. The shield of claim 1, wherein the module is a fiber-optic module.

7. The shield of claim 1, wherein the module is an electrical module.

8. A module, comprising:

a housing;

an adapter residing within the housing for engaging a connector for a signal carrying medium;

a sleeve coupled to the adapter; and

an electromagnetic interference shield, comprising;

an outer edge, the outer edge comprising a plurality of springs, each of the plurality of springs comprising bent tips,

an opening proximate to a center of the shield, the opening comprising a plurality of teeth at an edge of the opening, wherein the plurality of teeth couple the shield to the sleeve, and

a plurality of extensions at the outer edge wherein each extension resides between two of the plurality of springs.

9. The module of claim 8, wherein the plurality of teeth provide a Tinnerman-type coupling with the sleeve.

10. The module of claim 8, wherein the shield is comprised of a sheet of metal.

11. The module claim 8, wherein the bent tips contact an enclosure faceplate when the module resides on a printed circuit board.

12. The module of claim 8, wherein the bent tips comprise a spring force along a direction approximately parallel to an optic axis.

13. The module of claim 8, wherein the extensions reduce gaps between the springs.

14. The module of claim 8, wherein the module is a fiber-optic module.

15. The module of claim 14, wherein the signal-carrying medium comprises optical fibers.

16. The module of claim 8, wherein the module is an electrical module.

17. The module of claim 16, wherein the bent tips comprise a spring force along a direction approximately perpendicular to a surface of an enclosure faceplate.