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High temperature eutectic solder ball attach

  • US 6,824,041 B2
  • Filed: 10/21/2002
  • Issued: 11/30/2004
  • Est. Priority Date: 10/21/2002
  • Status: Expired due to Fees
First Claim
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1. A ball grid array package, comprising:

  • an array of eutectic solder balls on a surface of the ball grid array package; and

    at least one high melt ball on the same surface of the BGA package, wherein said at least one high melt ball has pre-flow diameter of approximately 15-20 mils.

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