Circuit elements having an embedded conductive trace and methods of manufacture

• US 6,824,857 B2
• Filed: 04/01/2002
• Issued: 11/30/2004
• Est. Priority Date: 04/02/2001
• Status: Expired due to Fees

• Current Assignee: NASHUA CORPORATION (Cenveo Incorporated)
• Original Assignee: NASHUA CORPORATION (Cenveo Incorporated)
• Inventors: Lochun, Darren, Ireland, John J.
• Primary Examiner(s): Jones, Deborah
• Assistant Examiner(s): Xu, Ling
• Application Number:
  US10/113,733
• Publication Number:
  US 20020171065A1
• Time in Patent Office: 974 Days
• Field of Search: 428/209, 428/901, 428/402-403, 428/426, 428/441, 428/446, 428/473.5, 428/480, 428/500, 428/515, 428/520, 428/521, 428/522, 428/430, 428/211, 428/546, 428/935, 428/458, 428/462, 361/748, 361/751
• US Class Current: 428/209
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: H01F 2017/006 flexible printed inductors
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias reinforcing the conductive pattern H05K3/24
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 3/107 by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence
• CPC Class Codes: H05K 3/1258 by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
• CPC Class Codes: H05K 3/245 Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
• CPC Class Codes: H05K 3/246 Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
• CPC Class Codes: H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/2982 Particulate matter [e.g., sphere, flake, etc.]
• CPC Class Codes: Y10T 428/31645 Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31721 : Of polyimide
• CPC Class Codes: Y10T 428/31786 : Of polyester [e.g., alkyd, etc.]
• CPC Class Codes: Y10T 428/31855 : Of addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31909 : Next to second addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31928 : Ester, halide or nitrile of addition polymer
• CPC Class Codes: Y10T 428/31931 : Polyene monomer-containing
• CPC Class Codes: Y10T 428/31935 : Ester, halide or nitrile of addition polymer

Abstract

Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a circuit element. The method includes the steps of providing a thermoplastic substrate having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace, and embedding the trace into the thermoplastic substrate by heating the thermoplastic substrate to a temperature above about the softening temperature about the trace.

Claims

1. A circuit element comprising:

a thermoplastic substrate having a softening temperature less than about 250°

F.;

a conductive trace at least partially embedded in the thermoplastic substrate; and

a second substrate disposed adjacent to the thermoplastic substrate and opposite the conductive trace, wherein the second substrate has a second softening temperature that is higher than the softening temperature of the thermoplastic substrate.

2. The circuit element of claim 1 wherein the thermoplastic substrate is formed from a polymer selected from the group consisting of polyethylene, polyethylene naphthalate, synthetic paper, polystyrene, and copolymers and combinations thereof.

3. The circuit element of claim 1 wherein the thermoplastic substrate is hot melt coated, co-extruded or laminated onto the second substrate.

4. The circuit element of claim 1 wherein the second substrate is formed from a material selected from the group consisting of polyimide, polyethylene naphthalate, polyphenylene sulfide, polyester, synthetic paper, polystyrene, copolymers thereof, metal, metal foils, glass, silica, and combinations thereof.

5. The circuit element of claim 1 further comprising a third substrate, wherein the third substrate is disposed adjacent to the second substrate opposite the thermoplastic substrate.

6. The circuit element of claim 5 wherein the third substrate is a third thermoplastic substrate, and the circuit element further comprises a conductive trace at least partially embedded in the third thermoplastic substrate.

7. The circuit element of claim 1 wherein the conductive trace comprises a plurality of conductive particles having a particle size distribution having at least two modes.

8. The circuit element of claim 7 wherein the conductive particles comprise a conductive powder and a plurality of conductive flakes, the conductive flakes having a mean aspect ratio between about 2 and about 50.

9. The circuit element of claim 1 wherein the conductive trace comprises a plurality of conjugated conductive particles.

10. The circuit element of claim 1 comprising an electrolytic conductive plating disposed on the conductive trace.

11. The circuit element of claim 1 further comprising a protective coating disposed on a surface of the circuit element.

12. A circuit element comprising:

a thermoplastic substrate selected from the group consisting of ethylene vinyl acetate, ethylene ethyl acetate, polyethylene, polypropylene, polycarbonate, polyethylene napthalate, polyester, synthetic paper and polystyrene;

a conductive trace at least partially embedded in the thermoplastic substrate; and

a second substrate disposed adjacent to the thermoplastic substrate and opposite the conductive trace, wherein the second substrate has a second softening temperature that is higher than the softening temperature of the thermoplastic substrate.

13. The circuit element of claim 12 wherein the thermoplastic substrate is ethylene vinyl acetate.

14. The circuit element of claim 12 wherein the thermoplastic substrate is ethylene ethyl acetate.

15. The circuit element of claim 12 wherein the thermoplastic substrate is polyethylene.

16. The circuit element of claim 12 wherein the thermoplastic substrate is polypropylene.

17. The circuit element of claim 12 wherein the thermoplastic substrate is polycarbonate.

18. The circuit element of claim 12 wherein the thermoplastic substrate is polyethylene napthalate.

19. The circuit element of claim 12 wherein the thermoplastic substrate is polyester.

20. The circuit element of claim 12 wherein the thermoplastic substrate is synthetic paper.

21. The circuit element of claim wherein the thermoplastic substrate is polystyrene.