Semiconductor device and manufacturing method thereof
First Claim
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1. A semiconductor device comprising:
- a first semiconductor layer and a second semiconductor layer over an insulating surface;
a first insulating film over the first semiconductor layer and over the second semiconductor layer;
a first electrode over the first insulating film, said first electrode overlapping the first semiconductor layer;
a second electrode over the first insulating film, said second electrode overlapping the second semiconductor layer;
a source wiring over the first insulating film;
a second insulating film covering the first electrode and the source wiring;
a gate wiring over the second insulating film, said gate wiring connected to the first electrode;
a connection electrode over the second insulating film, said connection electrode connected to the source wiring and the first semiconductor layer; and
a pixel electrode over the second insulating film, said pixel electrode connected to the first semiconductor layer;
wherein the pixel electrode overlays the source wiring with the second insulating film interposed therebetween.
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Abstract
The aperture ratio of a pixel of a reflecting type display device is improved without increasing the number of masks and without using a black mask. Locations for light shielding between pixels are arranged such that a pixel electrode overlaps with a portion of a gate wiring and a source wiring. In locations for shielding TFTs, a high pixel aperture ratio is realized by forming a color filter (red, or lamination of red and blue), formed on an opposing substrate.
131 Citations
11 Claims
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1. A semiconductor device comprising:
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a first semiconductor layer and a second semiconductor layer over an insulating surface;
a first insulating film over the first semiconductor layer and over the second semiconductor layer;
a first electrode over the first insulating film, said first electrode overlapping the first semiconductor layer;
a second electrode over the first insulating film, said second electrode overlapping the second semiconductor layer;
a source wiring over the first insulating film;
a second insulating film covering the first electrode and the source wiring;
a gate wiring over the second insulating film, said gate wiring connected to the first electrode;
a connection electrode over the second insulating film, said connection electrode connected to the source wiring and the first semiconductor layer; and
a pixel electrode over the second insulating film, said pixel electrode connected to the first semiconductor layer;
wherein the pixel electrode overlays the source wiring with the second insulating film interposed therebetween. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
the first semiconductor layer contains an impurity element which imparts one conductivity into the semiconductor; and
the second semiconductor layer contains an impurity element which imparts one conductivity, opposite to that contained in the first semiconductor layer, into the semiconductor.
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5. A device according to claim 1, wherein the gate wiring comprising an element selected from the group consisting of polysilicon doped with an impurity element which imparts one conductivity;
- W;
WSix;
Al;
Cu;
Ta;
Cr; and
Mo as its main constituent, and a lamination film of the elements.
- W;
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6. A device according to claim 1, wherein the second insulating film is composed of a first insulating layer having silicon as its main constituent, and a second insulating layer comprising an organic resin material.
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7. A device according to claim 1, wherein the semiconductor device is a reflecting type liquid crystal display device.
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8. A device according to claim 1, wherein the semiconductor device is a device selected from the group consisting of a personal computer, a video camera, a portable information terminal, a digital camera, a digital video disk player, and an electronic amusement device.
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9. A device according to claim 1, wherein said first insulating film is a gate insulating film.
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10. A device according to claim 1, wherein the first electrode and the source wiring comprise the same material and are formed by the same process.
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11. A device according to claim 1, wherein the second electrode is a capacitor electrode.
Specification