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Semiconductor device and manufacturing method thereof

  • US 6,825,488 B2
  • Filed: 01/26/2001
  • Issued: 11/30/2004
  • Est. Priority Date: 01/26/2000
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a first semiconductor layer and a second semiconductor layer over an insulating surface;

    a first insulating film over the first semiconductor layer and over the second semiconductor layer;

    a first electrode over the first insulating film, said first electrode overlapping the first semiconductor layer;

    a second electrode over the first insulating film, said second electrode overlapping the second semiconductor layer;

    a source wiring over the first insulating film;

    a second insulating film covering the first electrode and the source wiring;

    a gate wiring over the second insulating film, said gate wiring connected to the first electrode;

    a connection electrode over the second insulating film, said connection electrode connected to the source wiring and the first semiconductor layer; and

    a pixel electrode over the second insulating film, said pixel electrode connected to the first semiconductor layer;

    wherein the pixel electrode overlays the source wiring with the second insulating film interposed therebetween.

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