×

Multichip wafer level packages and computing systems incorporating same

  • US 6,825,553 B2
  • Filed: 09/05/2003
  • Issued: 11/30/2004
  • Est. Priority Date: 08/27/2002
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device package, comprising:

  • a plurality of semiconductor dice, each semiconductor die of the plurality having a back surface, an active surface and a plurality of signal connection devices on the active surface;

    a substrate having an attachment surface, an opposing surface and a plurality of openings formed therethrough, wherein each of the plurality of signal connection devices is positioned in one of the plurality of openings and the active surfaces of the plurality of semiconductor dice are adhered to the attachment surface of the substrate permitting exposure of the plurality of signal connection devices through the plurality of openings; and

    a molding layer disposed over the attachment surface of the substrate and the back surfaces of the plurality of semiconductor dice.

View all claims
  • 7 Assignments
Timeline View
Assignment View
    ×
    ×