Localized backside chip cooling with integrated smart valves

• US 6,825,557 B2
• Filed: 12/17/2002
• Issued: 11/30/2004
• Est. Priority Date: 12/17/2002
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: DiBattista, Michael, Livengood, Richard H.
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US10/321,339
• Publication Number:
  US 20040113265A1
• Time in Patent Office: 714 Days
• Field of Search: 257/712, 257/713, 257/714, 438/106, 438/122
• US Class Current: 257/712
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

An integrated circuit device is disclosed. The device comprises a die that has functional units on a first surface and a cooling system arranged adjacent a second surface opposite the first surface. The cooling system comprises a least one microchannel to contain a cooling liquid and to allow flow of the cooling liquid and at least one reservoir arranged adjacent to a region of the die. There is at least one valve between the reservoir and the microchannel to allow the cooling liquid to flow into the reservoir wherein flow of the cooling liquid depends upon a temperature of the die region.

Claims

1. An integrated circuit device, comprising:

a die, having functional units on a first surface;

a cooling system arranged adjacent a second surface opposite the first surface, the cooling system comprising;

a least one microchannel to contain a cooling material and to allow flow of the cooling material;

at least one reservoir arranged adjacent to a region of the die; and

at least one valve between the reservoir and the microchannel to allow the cooling material to flow into the reservoir wherein flow of the cooling liquid depends upon a temperature of the die region.

2. The device of claim 1, wherein the reservoir further comprises multiple reservoirs arranged uniformly.

3. The device of claim 1, wherein the region of the die further comprises a region of the die on the second surface opposite at least one functional unit arranged on the first surface.

4. The semiconductor device of claim 3, wherein the device further comprises one reservoir for each functional unit.

5. The semiconductor device of claim 1, wherein at least one valve further comprises two valves for each reservoir.

6. The semiconductor device of claim 5, wherein the two valves further comprise an input valve and an output valve.

7. The semiconductor device of claim 1, wherein the cooling material further comprises water.

8. A cooling system, comprising:

a microchannel to contain a cooling material and to allow flow of the cooling material;

at least one reservoir arranged adjacent a region of a die;

at least one temperature-sensitive valve to allow cooling material to flow between the microchannel and the reservoir, wherein flow of the cooling material depends upon a temperature of the die region.

9. The cooling system of claim 8, wherein the cooling system further comprises a pump.

10. The cooling system of claim 8, wherein the cooling system further comprises at least one heat sink.

11. The cooling system of claim 8, wherein at least one reservoir further comprises multiple reservoirs.

12. The cooling system of claim 8, wherein the region of the die is located on a second surface opposite a location of a functional unit on a first surface.

13. The cooling system of claim 8, wherein the temperature-sensitive valve further comprises a structure of at least two different materials.

14. The cooling system of claim 8, wherein the temperature-sensitive valve is arranged in a default curved position.

15. The cooling system of claim 8, wherein the temperature-sensitive valve is arranged in a default straight position.

16. The cooling system of claim 8, wherein the cooling system further comprises at least one pressure-sensitive valve.

17. The cooling system of claim 16, wherein the pressure-sensitive valve is to allow flow of the cooling material from the reservoir to the microchannel and the temperature-sensitive valve is to allow flow from the microchannel to the reservoir.

18. A method of cooling a semiconductor die, the method comprising:

providing at least one microchannel to allow flow of a cooling material;

arranging at least one reservoir to receive the cooling material, wherein the reservoir is arranged adjacent to a die region;

positioning at least one valve to allow cooling material to flow between the reservoir and the microchannel, wherein flow of the cooling material depends upon the temperature of the die region adjacent to the reservoir.

19. The method of claim 18, wherein arranging at least one reservoir further comprises arranging the reservoir is arranged adjacent a die region, wherein the die region is on a second surface opposite a functional unit on a first surface.

20. The method of claim 18, wherein positioning at least one valve further comprises two valves.

21. The method of claim 18, wherein the two valves further comprises an input valve and an output valve.

22. A valve, comprising:

a first layer of a first material having a first temperature coefficient of expansion; and

a second layer of a second material disposed on the first layer, wherein the second material has a second temperature coefficient of expansion different from the first temperature coefficient of expansion, such that temperature changes cause the valve to actuate with no control system.

23. The valve of claim 22 further comprising a base layer upon which the first and second layers reside.

24. The valve of claim 22 further comprising a reservoir adjacent the layers, arranged such that the layers overhang the reservoir.

25. The valve of claim 22 wherein the first temperature coefficient of expansion is higher than the second temperature coefficient of expansion.

26. The valve of claim 22 wherein the first temperature coefficient of expansion is lower than the second temperature coefficient of expansion.

27. The valve of claim 22 wherein the valve is in the default curved position.

28. The valve of claim 22 wherein the valve is in the default straight position.

29. A heat pipe system, comprising:

a heat sink;

a heat transfer media to allow a cooling material to flow between the heat sink and a region needing cooling and heated vapor to flow between the region needing cooling and the heat sink; and

a temperature-sensitive smart valve to allow control of the flow of the cooling material.

30. The heat pipe system of claim 29, the heat transfer media further comprising microchannels covered with a thermal management cap.