Group III nitride based flip-chip intergrated circuit and method for fabricating

• US 6,825,559 B2
• Filed: 01/02/2003
• Issued: 11/30/2004
• Est. Priority Date: 01/02/2003
• Status: Active Grant

• Current Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Parikh, Primit, Wu, Yifeng, Mishra, Umesh K.
• Primary Examiner(s): NGUYEN, CUONG QUANG
• Application Number:
  US10/335,915
• Publication Number:
  US 20040130037A1
• Time in Patent Office: 698 Days
• Field of Search: 257/758-773, 257/728, 257/744, 257/532-533
• US Class Current: 257/728
• CPC Class Codes: H01L 21/8252 the substrate being a semiconductor, using III-V technology H01L21/8258 takes precedence
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/147 Semiconductor insulating substrates semiconductor conductive substrates H01L23/4926
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 27/0605 integrated circuits made of compound material, e.g. AIIIBV
• CPC Class Codes: H01L 29/2003 Nitride compounds
• CPC Class Codes: H01L 29/7787 with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01002 Helium [He]
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12032 : Schottky diode
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/19011 : including integrated passive components
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19103 : interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H05K 1/0206 : by printed thermal vias
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/066 : Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A flip-chip integrated circuit includes a circuit substrate having electronic components. The circuit substrate typically includes GaAs or Si. Another substrate can include Group III nitride based active semiconductor devices. This substrate typically includes SiC and can be separated to provide individual nitride devices. After separation, one or more of the Group III devices can be flip-chip mounted onto the circuit substrate. The electronic components on the circuit substrate can be coupled to the nitride devices using conductive interconnects and/or vias.

Claims

1. A flip-chip integrated circuit, comprising:

a circuit substrate having drive electronics on one surface;

an active semiconductor device comprising a substrate with layers of semiconductor material and a plurality of terminals, each of said terminals in electrical contact with one of said layers of semiconductor material, said active semiconductor device flip-chip mounted on said circuit substrate, at least one of said terminals in electrical contact with said drive electronics; and

at least one conductive vias through said circuit substrate, each of said conductive vias in electrical contact with one of said plurality of terminals.

2. The integrated circuit of claim 1, wherein each of said at least one vias comprises a hole through said circuit substrate, the surface of said hole covered by a first layer of conductive material.

3. The integrated circuit of claim 2, further comprising a second layer of conductive material on the surface of said circuit substrate opposite said drive electronics.

4. The integrated circuit of claim 3, wherein said second layer of conductive material is in electrical and thermal contact with said first layer of conductive material, said second layer of conductive material forming a ground for said vias and dissipating heat from said active semiconductor device.

5. The integrated circuit of claim 1, further comprising at least one heat sink base plate to help dissipate heat from said active semiconductor device and drive electronics.

6. The integrated circuit of claim 5, wherein said at least one heat sink base plate comprises a heat sink base plate arranged adjacent to said substrate.

7. The integrated circuit of claim 1, wherein each of said at least one vias further comprises a plug of conductive material at the top of said via.

8. The integrated circuit of claim 1, wherein said drive electronics comprise passive components and interconnects.

9. The integrated circuit of claim 1, wherein said drive electronics comprise pre-stage amplifiers and interconnects.

10. The integrated circuit of claim 7, further comprising a conductive bonding pad between each of said at least one terminal and vias that are in electrical contact.

11. A flip-chip integrated circuit, comprising:

a circuit substrate having drive electronics on one surface;

an active semiconductor device comprising a substrate with layers of semiconductor material and a plurality of terminals, each of said terminals in electrical contact with one of said layers of semiconductor material, said active semiconductor device flip-chip mounted on said circuit substrate, at least one of said terminals in electrical contact with said drive electronics;

a second layer of conductive material on the surface of said circuit substrate opposite said drive electronics; and

at least one heat sink base plate to help dissipate heat from said active semiconductor device and drive electronics, wherein said at least one heat sink base plate comprises a heat sink base plate arranged adjacent to said second conductive layer.

12. The integrated circuit of claim 11, wherein said layers of semiconductor material are Group III nitride based materials and said substrate is sapphire or silicon carbide.

13. A flip-chip integrated circuit, comprising:

a high electron mobility transistor (HEMT) comprising;

a substrate;

a high resistivity semiconductor layer on said substrate;

a barrier semiconductor layer on said high resistivity layer, said barrier layer having a wider bandgap than said high resistivity layer;

a two-dimensional electron gas between said barrier layer and said high resistivity layer;

respective source and drain contacts on said high resistivity layer and contacting said barrier layer;

a gate contact on said barrier semiconductor layer; and

a circuit substrate comprising drive electronics on one surface and a conductive vias, said HEMT flip-chip mounted on said circuit substrate with said source contact in electrical contact with said conductive vias, and said gate and drain contacts in electrical contact with said drive electronics.

14. The integrated circuit of claim 13, wherein said high resistivity semiconductor layer and said barrier semiconductor layer are made of a Group III nitride semiconductor material.

15. The integrated circuit of claim 13, wherein said substrate is made of a material from the group consisting of sapphire and silicon carbide.

16. The integrated circuit of claim 13, further comprising a layer of conductive material on the surface of said circuit substrate opposite said passive components, said layer of conductive material in electric and thermal contact with said vias.

17. The integrated circuit of claim 13, further comprising one or more heat sink base plates to dissipate heat from said HEMT and said passive components.

18. The integrated circuit of claim 13, wherein said drive electronics comprise pre-stage amplifiers and integrated circuits.