Apparatus for determining dynamic gaps between a proximity probe and a conductive target material

• US 6,825,676 B2
• Filed: 05/27/2003
• Issued: 11/30/2004
• Est. Priority Date: 10/22/1999
• Status: Expired due to Fees

• Current Assignee: Bently Nevada Incorporated (General Electric Company)
• Original Assignee: Bently Nevada Incorporated (General Electric Company)
• Inventors: Slates, Richard D.
• Primary Examiner(s): Zarneke, David A.
• Assistant Examiner(s): Kobert, Russell M
• Application Number:
  US10/445,573
• Publication Number:
  US 20030222639A1
• Time in Patent Office: 553 Days
• Field of Search: 324/603, 324/607, 324/608, 324/662, 324/671, 324/699, 324/713, 324/716, 324/207.15, 324/207.16, 702/155, 702/158, 702/65, 702/166, 702/116
• US Class Current: 324/699
• CPC Class Codes: G01B 7/003 for measuring position, not involving coordinate determination coordinate measuring G01B7/004
• CPC Class Codes: G01B 7/023 for measuring distance between sensor and object G01B7/082 and G01B7/102 take precedence
• CPC Class Codes: G01D 18/00 Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
• CPC Class Codes: G01D 5/202 by movable a non-ferromagnetic conductive element G01D5/2033 takes precedence
• CPC Class Codes: G01N 27/9046 by analysing electrical signals

Abstract

A digital eddy current proximity system including a digital impedance measuring device for digitally measuring the proximity probes impedance correlative to displacement motion and position of a metallic target object being monitored. The system further including a cable-length calibration method, an automatic material identification and calibration method, a material insensitive method, an inductive ratio method and advanced sensing characteristics.

Claims

1. An apparatus for determining a dynamic gaps between a proximity probe and a conductive target material, said apparatus comprising in combination:

means for establishing dynamic voltage signals correlative to dynamic gaps between a proximity probe and a conductive target material;

sampling means for digitizing said established dynamic voltage signals into digital voltage signals;

a digital multiplier for multiplying each said digital voltage signal by a digital sine signal and a digital cosine signal;

means for accumulating values of each multiply in a memory, and

means for processing each multiply for obtaining complex voltage representations correlative to dynamic gaps between said proximity probe and a conductive target material.

2. The apparatus of claim 1 wherein said means for establishing dynamic voltage signals correlative to dynamic gaps between said proximity probe and said conductive target material includes a network including a first electrical component and said proximity probe serially connected, and a signal generating means operatively coupled to said network for driving a current through said serial connection wherein a first analog voltage is impressed across said network and a second analog voltage is impressed across said proximity probe for establishing said dynamic voltage signals.

3. The apparatus of claim 2 wherein said sampling means for digitizing said established dynamic voltage signals into digital voltage signals includes means for sampling and digitizing said first analog voltage impressed across said network and said second analog voltage impressed across said proximity probe into first and second digitized voltages respectively.

4. The apparatus of claim 3 wherein said digital multiplier multiplies each of said first and second digitized voltages by said digital sine signal and said digital cosine signal for forming first complex number and second complex number pairs.

5. The apparatus of claim 4 wherein said means for processing each multiply for obtaining said complex voltage representations correlative to said dynamic gaps between said proximity probe and said conductive target material includes means for determining voltage ratios of each said complex number pair by determining a ratio of said second complex number to a difference between said first complex number and said second complex number for each said pair and processing with said processing means said voltage ratios into values correlative to said dynamic gaps between said proximity probe and said conductive target material.