Integrated circuit inductors
First Claim
1. An integrated circuit comprising:
- a substrate having a coating;
a circuit formed on the substrate; and
a conductive path operable for creating a magnetic field in the coating, and coupled to the circuit.
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Accused Products
Abstract
The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.
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Citations
37 Claims
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1. An integrated circuit comprising:
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a substrate having a coating;
a circuit formed on the substrate; and
a conductive path operable for creating a magnetic field in the coating, and coupled to the circuit. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An integrated circuit comprising:
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a substrate having a first region with a coating formed in the first region;
a circuit formed on a second region of the substrate;
a conductive path formed through the substrate, the conductive path having a portion that traverses the coating and operable to create a magnetic field in the coating; and
wherein the circuit is coupled to the conductive path. - View Dependent Claims (8, 9, 10, 11)
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12. An integrated circuit comprising:
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a substrate;
a coating covering a portion of the substrate;
a conductive coil surrounding the portion of the substrate, with a portion of the coil traversing a portion of the coating so as to create a magnetic field in the portion of the coating; and
a circuit formed on the substrate and connected to the coil. - View Dependent Claims (13, 14, 15, 16, 17)
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18. An integrated circuit comprising:
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a semiconductor substrate having a magnetic film;
a circuit formed on the substrate spaced apart from the magnetic film;
a conductive coil formed in the substrate and magnetically coupled to the magnetic film to create a magnetic field in the magnetic film;
leads connected to the coil; and
wherein the circuit is electrically connected to the leads. - View Dependent Claims (19, 20, 21, 22)
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23. An integrated circuit comprising:
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a substrate having first and second sides;
first and second magnetic films formed the first and second sides, respectively;
a circuit formed on the first side of the substrate; and
a conductive path traversing the first and second magnetic films and passing through the substrate, the conductive path operable to create a magnetic field in the first and second magnetic films; and
wherein the circuit is connected to the conductive path. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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30. An integrated circuit comprising:
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a substrate having a planar surface with a coating formed on a portion of the planar surface;
a conductive path in the form of a triangular coil having first segments that traverse the coating, the triangular coil designed to create a magnetic field in a portion of the coating when an electrical current passes through the coil; and
a circuit formed on the substrate and operatively coupled to coil. - View Dependent Claims (31, 32, 33)
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34. An integrated circuit comprising:
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a planar substrate;
a coating formed on a portion of the planar substrate;
a coil having first segments passing through the substrate adjacent the coating and second segments traversing the coating and connecting the first segments, the coil operative to form a magnetic field in the coating; and
a circuit formed integral with the substrate and operatively connected to the coil. - View Dependent Claims (35, 36, 37)
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Specification