Symmetric crossover structure of two lines for RF integrated circuits

• US 6,825,749 B1
• Filed: 01/26/2004
• Issued: 11/30/2004
• Est. Priority Date: 01/26/2004
• Status: Expired due to Fees

• Current Assignee: National Chip Implementation Center National Applied Research Laboratories
• Original Assignee: National Chip Implementation Center National Applied Research Laboratories
• Inventors: Li, Li-E, Lin, Tser Yu, Sha, Chu-Jung, Chiu, Chin-Fong, Juang, Ying-Zong
• Primary Examiner(s): Nguyen, Tuyen T.
• Application Number:
  US10/763,192
• Time in Patent Office: 309 Days
• Field of Search: 336/65, 336/192, 336/200, 336/205-206, 336/232, 336/180-182
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01F 2021/125 Printed variable inductor with taps, e.g. for VCO
• CPC Class Codes: H01L 23/5221 Crossover interconnections
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In a symmetric crossover structure of two lines formed of a lower conductor layer and a higher conductor layer above a substrate, each of the two lines is branched to two routes at where they are crossed over to each other. The first route of the first line uses the higher layer to cross the first route of the second line and the lower layer to cross over the second route of the second line. The second route of the first line uses the lower layer to cross over the first route of the second line and the higher layer to cross over the second route of the second line. The two lines therefore have symmetric coupling effects to the substrate.

Claims

1. A symmetric crossover structure of two lines formed of a lower conductor layer and a higher conductor layer above a substrate, the structure comprising:

a first line branched to a first route and a second route; and

a second line branched to a third route and a fourth route;

wherein the first route has a first segment to cross over the third route from the higher conductor layer and a second segment to cross over the fourth route from the lower conductor layer, the second route has a third segment to cross over the third route from the lower conductor layer and a fourth segment to cross over the fourth route from the higher conductor layer, the third route has a fifth segment to cross over the second route from the higher conductor layer and a sixth segment to cross over the first route from the lower conductor layer, and the fourth route has a seventh segment to cross over the second route from the lower conductor layer and an eighth segment to cross over the first route from the higher conductor layer.

2. The crossover structure of claim 1, wherein the first and third segments are connected together, the second and forth segments are connected together, the fifth and seventh segments are connected together, and the sixth and eighth segments are connected together.

3. The crossover structure of claim 1, wherein the first and sixth segments cross over to each other, the second and eighth segments cross over to each other, the third and fifth segments cross over to each other, and the fourth and seventh segments cross over to each other.

4. The crossover structure of claim 1, wherein the first and second routes form a first parasitic capacitor, and the third and fourth routes form a second parasitic capacitor.

5. The crossover structure of claim 4, wherein the first and second parasitic capacitors are symmetric to the center of the crossover structure.