Shaped electrodes for micro-electro-mechanical-system (MEMS) devices to improve actuator performance and methods for fabricating the same

• US 6,825,967 B1
• Filed: 09/29/2000
• Issued: 11/30/2004
• Est. Priority Date: 09/29/2000
• Status: Expired due to Term

• Current Assignee: Calient Networks Incorporated
• Original Assignee: Calient Networks Incorporated
• Inventors: Lewis, Robert, Lee, Seung Bok, MacDonald, Noel, Chong, John, Hunt, Peter
• Primary Examiner(s): Epps, Georgia
• Assistant Examiner(s): TRA, TUYEN Q
• Application Number:
  US09/676,459
• Time in Patent Office: 1,523 Days
• Field of Search: 359/290, 359/291, 359/295, 359/298, 359/293, 359/294, 359/900
• US Class Current: 359/290
• CPC Class Codes: B81C 1/00357 involving bonding one or several substrates on a non-temporary support, e.g. another substrate
• CPC Class Codes: B81C 1/00619 Forming high aspect ratio structures having deep steep walls
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: Y10S 359/90 Methods

Abstract

Shaped electrodes for micro-electro-mechanical-system (MEMS) devices to improve actuator performance and methods for fabricating the same are disclosed. The shaped electrodes utilize its three-dimensional geometry to shape an electric field for electrostatic actuation for MEMS devices. For example, the height, width, length, sidewall slope, and layout of the shaped electrodes can be used to provide an optimum electric field in moving a MEMS mirror device. The shaped electrodes can provide electrostatic actuation at a low operating voltage and provide an optimum electric field for maximum tilt or angular range of motion for a MEMS mirror device. The shaped electrodes can be fabricated simply by using a pillar wafer and an electrode wafer. The pillar wafer can be used to form pillars as electrodes, or, alternatively, as barriers. A single substrate can also be used to form pillars and electrodes.

Claims

1. A method of fabricating a micro-electro-mechanical-system (MEMS) device, the method comprising:

attaching a pillar wafer to an electrode wafer; and

forming one or more pillars from the pillar wafer, wherein forming the shaped pillars includes forming “

L”

shaped pillars, slanted shaped pillars, curved shaped pillars, or pillars with slots formed therein.

2. The method of claim 1, further comprising:

forming one or more gimbaled mirror devices on the electrode wafer such that the pillars are to provide an electric field or to provide a barrier.

3. A method of fabricating a micro-electro-mechanical-system (MEMS) device, the method comprising:

forming a plurality of trenches in a first side of a substrate;

forming an insulator in the plurality of trenches and on the first side of the substrate such that the insulator defines exposed areas of the first side of the substrate;

forming a metal line on the insulator and exposed areas of the first side of the substrate; and

removing selectively portions of a second side of the substrate to form pillars connected with the insulator and metal line.

4. The method of claim 3, wherein removing selectively portions of the second side of the substrate includes forming shaped pillars.

5. The method of claim 3, wherein removing selectively portions of the second side of the substrate includes forming “

L”

shaped pillars, slanted shaped pillars, curved shaped pillars, or pillars with slots formed therein.

6. The method of claim 3, wherein forming the metal line includes forming a discontinuous metal line.

7. The method of claim 3, further comprising:

forming one or more gimbaled mirror devices on the substrate such that the pillars are to provide an electric field or to provide a barrier.