Planar optical devices and methods for their manufacture
First Claim
1. A method of making a composite sputtering target comprising a plurality of tiles, the target used for physical vapor deposition of material, the method comprising:
- sputter coating a side of each of the plurality of tiles with a wetting layer material to within an offset of the edge of each tile;
providing a backing plate composed of a metal with thermal expansion coefficient similar to the thermal expansion coefficient of the plurality of tiles;
plasma spray coating the backing plate with a ceramic material so as to cover the regions of the backing plate exposed during physical vapor deposition;
sputter coating regions of the backing plate corresponding in placement to the wetted regions of the tiles with a wetting layer;
wetting the sputtered regions of the plurality of tiles and of the backing plate with solder material; and
assembling the plurality of tiles on the backing plate so as to form a solder bonded non contacting array of uniformly spaced tiles.
8 Assignments
0 Petitions
Accused Products
Abstract
Physical vapor deposition processes provide optical materials with controlled and uniform refractive index that meet the requirements for active and passive planar optical devices. All processes use radio frequency (RF) sputtering with a wide area target, larger in area than the substrate on which material is deposited, and uniform plasma conditions which provide uniform target erosion. In addition, a second RF frequency can be applied to the sputtering target and RF power can be applied to the substrate producing substrate bias. Multiple approaches for controlling refractive index are provided. The present RF sputtering methods for material deposition and refractive index control are combined with processes commonly used in semiconductor fabrication to produce planar optical devices such surface ridge devices, buried ridge devices and buried trench devices. A method for forming composite wide area targets from multiple tiles is also provided.
95 Citations
5 Claims
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1. A method of making a composite sputtering target comprising a plurality of tiles, the target used for physical vapor deposition of material, the method comprising:
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sputter coating a side of each of the plurality of tiles with a wetting layer material to within an offset of the edge of each tile;
providing a backing plate composed of a metal with thermal expansion coefficient similar to the thermal expansion coefficient of the plurality of tiles;
plasma spray coating the backing plate with a ceramic material so as to cover the regions of the backing plate exposed during physical vapor deposition;
sputter coating regions of the backing plate corresponding in placement to the wetted regions of the tiles with a wetting layer;
wetting the sputtered regions of the plurality of tiles and of the backing plate with solder material; and
assembling the plurality of tiles on the backing plate so as to form a solder bonded non contacting array of uniformly spaced tiles. - View Dependent Claims (2, 3, 4, 5)
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Specification
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- Resources
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Current AssigneeDemaray LLC
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Original AssigneeSymmorphix, Inc. (Demaray LLC)
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InventorsZhang, Hongmei, Pethe, Rajiv, Demaray, Richard E., Wang, Kai-An, Mullapudi, Ravi B., Stadtler, Douglas P.
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Primary Examiner(s)VERSTEEG, STEVEN H
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Application NumberUS10/288,278Publication NumberTime in Patent Office764 DaysField of Search204/298.12, 204/192.12, 204/192.15, 427/452, 427/453, 156/60, 228/101US Class Current204/192.15CPC Class CodesC23C 14/345 using substrate biasC23C 14/35 by application of a magneti...G02B 2006/12097 Ridge, rib or the likeG02B 2006/12147 CouplerG02B 2006/1215 SplitterG02B 6/132 by deposition of thin filmsG02B 6/136 by etchingY10T 156/10 Methods of surface bonding ...
