Magnetoresistive sensor and manufacturing method therefor
First Claim
1. A magnetoresistive sensor comprising:
- upper and lower electrode layers;
a conducting path layer provided between said upper and lower electrode layers, said conducting path layer being formed by arranging a cylinder in an insulator, said cylinder comprising a tubular nonmetal and a cylindrical metal surrounded by said tubular nonmetal; and
a magnetoresistive film provided between said conducting path layer and one of said upper and lower electrode layers.
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Accused Products
Abstract
A magnetoresistive sensor including a lower electrode layer, a nanotube structure film composed of an insulator matrix and a plurality of nanotubes dispersively arranged in the insulator matrix, a magnetoresistive film provided on the nanotube structure film, and an upper electrode layer provided on the magnetoresistive film. Each nanotube is composed of a circular tubular nonmetal and a circular cylindrical metal surrounded by the circular tubular nonmetal. The nanotube structure film is partially etched at its central region to make conduction of the upper electrode layer and the lower electrode layer through the magnetoresistive film and the circular cylindrical metal of each nanotube present at the central region.
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Citations
13 Claims
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1. A magnetoresistive sensor comprising:
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upper and lower electrode layers;
a conducting path layer provided between said upper and lower electrode layers, said conducting path layer being formed by arranging a cylinder in an insulator, said cylinder comprising a tubular nonmetal and a cylindrical metal surrounded by said tubular nonmetal; and
a magnetoresistive film provided between said conducting path layer and one of said upper and lower electrode layers. - View Dependent Claims (3, 4, 5, 6)
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2. A magnetoresistive sensor comprising:
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upper and lower electrode layers;
a conducting path layer provided between said upper and lower electrode layers, said conducting path layer being formed by arranging in an insulator matrix at least one cylindrical metal in a tube having high resistivity, said conducting path layer having a first region and a second region smaller in film thickness than said first region; and
a magnetoresistive film provided between said conducting path layer and one of said upper and lower electrode layers.
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7. A manufacturing method for a magnetoresistive sensor, comprising the steps of:
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depositing a lower electrode layer on a substrate;
forming a cylindrical metal surrounded by a tubular nonmetal on said lower electrode layer;
depositing an insulator on said lower electrode layer after forming said cylindrical metal so that said cylindrical metal is embedded in said insulator to thereby form a conducting path layer;
depositing a magnetoresistive film on said conducting path layer; and
depositing an upper electrode layer on said magnetoresistive film. - View Dependent Claims (8)
partially etching said conducting path layer by using said resist pattern as a mask.
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9. A magnetoresistive sensor comprising:
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a lower electrode layer;
a nanotube structure film provided on said lower electrode layer, said nanotube structure film comprising an insulator matrix and a plurality of nanotubes dispersively arranged in said insulator matrix;
a magnetoresistive film provided on said nanotube structure film; and
an upper electrode layer provided on said magnetoresistive film;
each of said nanotubes comprising a circular tubular nonmetal and a circular cylindrical metal surrounded by said circular tubular nonmetal;
said nanotube structure film being partially etched at a central on thereof to make conduction of said upper electrode layer and said lower electrode layer through said magnetoresistive film and said circular cylindrical metal of each nanotube present at said central region. - View Dependent Claims (10, 11)
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12. A manufacturing method for a magnetoresistive sensor, comprising the steps of:
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depositing a lower electrode layer on a substrate;
forming a first resist pattern on said lower electrode layer;
etching said lower electrode layer by using said first resist pattern as a mask to form said lower electrode layer into a desired shape;
forming a plurality of nanotubes of Cr—
C on said lower electrode layer;
depositing an insulator matrix on said lower electrode layers that said plurality of nanotubes are embedded in said insulator matrix to form nanotube structure film;
forming a second resist pattern on said nanotube structure film;
etching said nanotube structure film by using said second resist pattern as a mask to remove an unwanted portion of said nanotube structure film;
forming a third resist pattern on said nanotube structure film;
etching a central region of said nanotube structure film so that the top of each nanotube present at said central region is exposed, by using said third resist pattern as a mask;
depositing a magnetoresistive film on said nanotube structure film;
depositing an upper electrode layer on said magnetoresistive film;
forming a fourth resist pattern on said upper electrode layer; and
etching said upper electrode layer by using said fourth resist pattern as a mask to form said upper electrode layer into a desired shape. - View Dependent Claims (13)
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Specification