Wafer shape evaluating method and device producing method, wafer and wafer selecting method
First Claim
1. A method for evaluating a wafer configuration comprising the steps of:
- measuring a configuration of a wafer at positions with a prescribed space within a surface of the wafer;
providing a first region within the wafer surface for calculating a reference line or a reference plane from the measured wafer configuration;
calculating a reference line or a reference plane in the first region as being representative of a whole wafer configuration;
providing a second region to be evaluated outside the first region;
extrapolating the reference line or reference plane to the second region;
analyzing a difference between the configuration of the second region and the reference line or reference plane within the second region; and
calculating the analyzed difference as surface characteristics.
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Abstract
There are provided a method and an apparatus for evaluating a wafer configuration which can accurately evaluate a peripheral portion of a wafer as compared with the conventional SFQR or the like, which comprises: measuring a configuration of a wafer at positions with a prescribed space within a surface of the wafer; providing a first region (W1) within the wafer surface for calculating a reference line or a reference plane from the measured wafer configuration; calculating a reference line (10a) or a reference plane (10b) in the first region (W1); providing a second region (W2) to be evaluated outside the first region; extrapolating the reference line (10a) or reference plane (10b) to the second region (W2); analyzing a difference between the configuration of the second region and the reference line or reference plane within the second region; and calculating the analyzed difference as surface characteristics.
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Citations
44 Claims
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1. A method for evaluating a wafer configuration comprising the steps of:
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measuring a configuration of a wafer at positions with a prescribed space within a surface of the wafer;
providing a first region within the wafer surface for calculating a reference line or a reference plane from the measured wafer configuration;
calculating a reference line or a reference plane in the first region as being representative of a whole wafer configuration;
providing a second region to be evaluated outside the first region;
extrapolating the reference line or reference plane to the second region;
analyzing a difference between the configuration of the second region and the reference line or reference plane within the second region; and
calculating the analyzed difference as surface characteristics. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 32, 37, 38, 41, 42)
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22. A method for evaluating a wafer configuration comprising the steps of:
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measuring a configuration of a wafer at positions with a prescribed space within a surface of the wafer;
providing a first region on the wafer surface for calculating a reference line or a reference plane from the measured wafer configuration;
calculating a reference line or a reference plane in the first region as being representative of a whole wafer configuration;
obtaining differences between the reference line or the reference plane and actually measured values within the first region; and
calculating a standard deviation σ
of the obtained differences as the surface characteristic C (undulation).- View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 33, 39, 40, 43, 44)
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34. An apparatus for evaluating a wafer configuration comprising:
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a configuration measuring unit for measuring a configuration of a wafer at positions with a prescribed space on a surface of the wafer;
a storage device for successively inputting and storing configuration data measured by the configuration measuring unit; and
a surface characteristic calculating unit for reading the configuration data of from the central portion of the wafer to the edge portion thereof from the storage device, calculating a reference line or a reference plane as being representative of a whole wafer configuration in a region of from the central portion of the wafer to an arbitrary portion thereof, analyzing a difference between the reference line or the reference plane and an arbitrary position, and calculating the analyzed difference as surface characteristics. - View Dependent Claims (35, 36)
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Specification